Semiconductors and electronics have been found to have an increasing use in automobile design. One key component of an automobile is the power module, which is a high voltage component that finds itself in extreme operating conditions. Due to this condition, the power module demands for highly effective terminal connections that can withstand the extreme operating condition specifically on the terminals that will connect the power module to the automobile system. Press fit technology has been a solution for cheap and reliable methods of creating interconnections since the 1980s; however, necessary innovations exist for more environmental design, and increase demand in quality and quantity. Press fits are simple, force-fitting connectors that allow permanent bonds without solder or adhesive bonding and a shortened process time. This research presents a unique methodology on the evaluation of the effects of the geometry to the insertion force and retention force using finite element analysis. The result showed that the geometry of the pin in a press fit pin configuration has a significant effect on the insertion force, retention force, as well as in the equivalent stress.
Proper design of semiconductors is the most essential step in ensuring electronic product reliability during manufacturing. The adoption of design optimization approach enhances the performance and reliability of the semiconductor package, hence, minimizes product failure. Semiconductor reliability especially in the application to automobiles is very crucial. High product failure tolerance in semiconductors in automobiles is required due to problems such as defects and malfunctions that are directly linked to casualty accidents. Such high tolerance requires keen quality control up to the semiconductor solder component level. This study aims to do a sensitivity analysis of the solder balls’ material properties and its effect on the stresses experienced by the semiconductor component with respect to its reliability using drop test. A drop test analysis was simulated wherein a shorter distance of 5 mm between the package and platform was implemented to make the simulation time faster. The density and modulus of elasticity of the solder ball material were identified as the independent factors while the stresses experienced by the BGA package during the drop test is the dependent variable. The results have shown that the maximum stress for all runs was found in the same area in the package. Changing the modulus of elasticity showed greater effect on the impact stress compared to the alteration of material density.
Solderless press-fit contacts in power module packages are now gaining more attention in the automotive industry especially in hybrid electric vehicles because of the Restriction of Hazardous Substances (RoHS) directive to eliminate lead-based connections. The production of press-fit assembly is also faster, more convenient, safer, and cheaper than soldered connections. In this paper, the effect of insertion speed of pin to the press-in force as well as the pull-out speed to the retention force was investigated using finite element analysis. An eye-of-the-needle (EON) shape compliant pin with general dimensions was adapted and a transient structural analysis in ANSYS mechanical was used to add and vary the speed of the press-fit pin geometry. Four simulations were conducted with different speeds. The results obtained by FEA show that the speed when kept at constant has no significant effect both on the press-in and retention force. However, when the speed changes due to acceleration, the press-in and pull-out force are both affected.
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