Novel electrically conductive composites were synthesized by incorporating Cu coated alumina (Cu‐Al2O3) powder prepared via electroless plating technique as filler (0–21wt %) into polystyrene‐b‐methylmethacrylate (PS‐b‐PMMA) and polystyrene (PS) matrices. XRD analysis depicted maximum Cu crystallite growth (26.116 nm∼ plating time 30 min) onto Al2O3 along with a significant change in XRD patterns of composites with Cu‐Al2O3 inclusion. SEM–EDX analyses exhibited uniform Cu growth onto Al2O3 and confirmed presence of Cu, Al, Pd in Cu‐Al2O3, and C, O, Al, Cu, and Pd in PS‐b‐PMMA and PS composites. Increasing filler loadings exhibited increased electrical conductivity (5.55 × 10−5S/cm for PS‐b‐PMMA; 5.0 × 10−6S/cm for PS) with increased Young's modulus (1122MPa for PS‐b‐PMMA; 1053.9MPa for PS) and tensile strength (27.998MPa for PS‐b‐PMMA; 30.585MPa for PS) and decreased % elongation. TGA demonstrated increased thermal stability and DTG revealed two‐step degradation in composites while DSC depicted pronounced increment in Tg of Cu‐Al2O3/PS‐b‐PMMA with increased filler loading. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016, 133, 42939.

Technological advancements and development of new materials may lead to the manufacture of sustainable energy-conducting devices used in the energy sector. This research attempts to fabricate novel electroconductive and mechanically stable nanocomposites via an electroless deposition (ELD) technique using electrically insulating materials. Metallic Cu is coated onto Al2O3 by ELD, and the prepared filler is then integrated (2–14 wt %) into a matrix of polystyrene-block-poly(ethylene-ran-butylene)-block-polystyrene-graft-maleic anhydride (PS-b-(PE-r-B)-b-PS-g-MA). Considerable variations in composite phases with filler inclusion exist. The Cu crystallite growth onto Al2O3 was evaluated by X-ray diffraction (XRD) analysis and energy dispersive spectrometry (EDS). Scanning electron microscopy (SEM) depicts a uniform Cu coating on Al2O3, while homogeneous filler dispersion is exhibited in the case of composites. The electrical behavior of composites is enhanced drastically (7.7 × 10−5 S/cm) upon incorporation of Cu–Al2O3 into an insulating polymer matrix (4.4 × 10−16 S/cm). Moreover, mechanical (Young’s modulus, tensile strength and % elongation at break) and thermal (thermogravimetric analysis (TGA), derivative thermogravimetry (DTG), and differential scanning calorimetry (DSC)) properties of the nanocomposites also improve substantially. These composites are likely to meet the demands of modern high-strength electroconductive devices.

The commencement of the industrial revolution paved the way for the fabrication of flexible polymers with high-strength metalloceramics as novel materials of all kinds. Fabricating metal-ceramic/polymer conductive composites is one such dimension followed for the present research work making use of the properties of the three components. Electroless deposition, for permanent metallic coating, was performed to coat Al 2 O 3 with metallic Cu followed by the inclusion of the Cu-Al 2 O 3 filler into a poly(vinyl chloride) (PVC) matrix. X-ray diffraction and energy-dispersive X-ray studies predicted a prominent growth of metallic Cu crystallites onto Al 2 O 3 with an increased average size and variation in elemental composition, respectively, when compared to pristine Al 2 O 3 . Morphological behaviour via scanning electron microscopy also envisioned uniform Cu coating onto Al 2 O 3 and a homogeneous dispersion throughout the polymer matrix. When incorporated into PVC, electrical conductivity analysis highlighted a distinct variation in composite phases from insulating (7.14 × 10 −16 S cm −1 ) to semiconducting behaviour (8.33 × 10 −5 S cm −1 ) as a function of Cu-Al 2 O 3 filler. Mechanical behaviour (tensile strength, Young's modulus and elongation at break) and thermal properties of the prepared composites also indicated a substantial improvement in material strength with Cu-Al 2 O 3 incorporation. The enhanced electrical conductivity along with improved thermomechanical status with significant filler-matrix interaction permits the potential usage of such novel composites in a range of state-of-the-art semiconducting electronic devices.

Release of toxic pollutants from industries, whether in the form of liquids or gases, has adversely affected the quality of the environment. To remediate the environment from such pollutants, a large number of conventional methods and advanced technologies have been developed and adopted. Amongst these innumerable methods, adsorption has emerged as one of the most significant processes to remove pollutants of a diverse nature. The present work is based on the ability of nanostructured materials as adsorbents for various gaseous and liquid pollutants. The mechanism of adsorption and desorption is elaborated along with factors that are responsible for the occurrence of such processes. The role of nano-sized carbonaceous, metallic, magnetic, metal oxides, clays, silicon and polymer-based materials, is highlighted as advanced nanosorbents to eradicate pollutants such as noxious gases, organic/inorganic chemicals, dyes, heavy metals, etc. released in the environment as a result of anthropogenic activities.