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To support the manufacture of complex products made of multiple micro-parts, a traceable and accurate 3D-measurement system with sub-micron accuracy is required. This paper investigates the use of a micro electro mechanical system (MEMS) tactile-micro-probe for 3D-coordinate metrology on the micro-scale. It will show that probe-tip contamination may be a significant source of error for such tactile-probing systems. Even in a clean-room environment, there are many types of contaminants that may affect dimensional measurement accuracy. These mainly come from repeated contact between probe tip and artefact material. To address this issue a number of cleaning methods were utilized to remove contaminants from the MEMS tactile-micro-probe sensor. Scanning electron microscopy was used to assess the efficacy of each cleaning method. Initial findings on different cleaning methods including ultrasonic, plasma, micro-beam melting, electron beam melting and cryogenic cleaning have shown that the latter is a feasible process.

When designing micro-scale tactile probes, a design trade-off must be made between the stiffness and flexibility of the probing element. The probe must be flexible enough to ensure sensitive parts are not damaged during contact, but it must be stiff enough to overcome attractive surface forces, ensure it is not excessively fragile, easily damaged or sensitive to inertial loads. To address the need for a probing element that is both flexible and stiff, a novel micro-scale tactile probe has been designed and tested that makes use of an active suspension structure. The suspension structure is used to modulate the probe stiffness as required to ensure optimal stiffness conditions for each phase of the measurement process. In this paper, a novel control system is presented that monitors and controls stiffness, allowing two probe stiffness values (“stiff” and “flexible”) to be defined and switched between. During switching, the stylus tip undergoes a displacement of approximately 18 µm, however, the control system is able ensure a consistent flexible mode tip deflection to within 12 nm in the vertical axis. The overall uncertainty for three-dimensional displacement measurements using the probing system is estimated to be 58 nm, which demonstrates the potential of this innovative variable stiffness micro-scale probe system.

This paper presents a MEMS Resonant Pressure Transducers (RPT) that is produced using a flexible fabrication route to allow pressure ranges from 1bar to 700bar in fully oil isolated hermetic packages without compromising sensor performance. The fabrication method makes use of silicon fusion bonding (SFB) and deep reactive ion etching (DRIE) to build up a three-layer die, with the middle layer consisting of a strain sensitive resonator. The key aspects of the fabrication process and sensor design that make this possible are presented, along with data showing long-term stability of better than 100ppm drift per year.

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Single crystal silicon (SCS) diaphragms are widely used as pressure sensitive elements in micromachined pressure sensors. However, for harsh environments applications, pure silicon diaphragms are hardly used because of the deterioration of SCS in both electrical and mechanical properties. To survive at the elevated temperature, the silicon structures must work in combination with other advanced materials, such as silicon carbide (SiC) or silicon on insulator (SOI), for improved performance and reduced cost. Hence, in order to extend the operating temperatures of existing SCS microstructures, this work investigates the mechanical behavior of pressurized SCS diaphragms at high temperatures. A model was developed to predict the plastic deformation of SCS diaphragms and was verified by the experiments. The evolution of the deformation was obtained by studying the surface profiles at different anneal stages. The slow continuous deformation was considered as creep for the diaphragms with a radius of 2.5 mm at 600 °C. The occurrence of plastic deformation was successfully predicted by the model and was observed at the operating temperature of 800 °C and 900 °C, respectively.

Abstract:Micro-scale probing systems are used on specialist micro-coordinate measuring machines to measure small, intricate and fragile components. Probe stiffness is a critical property of micro-scale probing systems; it influences contact force, robustness, ease of manufacture, accuracy and dynamic response. Selecting the optimum stiffness, therefore, represents a significant design challenge, and often leads to undesirable compromises. For example, when contacting fragile surfaces the probe stiffness should be low to prevent damage; however, for a more robust probing system the stiffness should be increased. This paper presents a novel concept for micro-scale probing systems with the ability to quickly and easily change and control probe stiffness during use. The intended strategy for using the proposed probe is first explained. Then the new concept is fully defined and explored through a combination of finite element analysis and experimental results. Two possible configurations of probe are described, and models for predicted performance for each are presented and compared. The models demonstrate significant stiffness reduction is possible with the proposed concept, and show it is theoretically possible to achieve a probing system with perfectly isotopic stiffness.