Advances in Silicon Resonant Pressure Transducers

Kinnell, Peter; Craddock, R.

doi:10.1016/j.proche.2009.07.026

Cited by 39 publications

(24 citation statements)

References 2 publications

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“…The sensor can be used in the manufacture of silicon micro-pump components, having broad application prospects in MEMS micro-flow devices and medical scientific research [6].…”

Section: Introductionmentioning

confidence: 99%

Research on Electromagnetic Excitation Resonant Sensor Based on Microelectromechanical System

Zhao

2015

TELKOMNIKA

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“…The sensor can be used in the manufacture of silicon micro-pump components, having broad application prospects in MEMS micro-flow devices and medical scientific research [6].…”

Section: Introductionmentioning

confidence: 99%

Research on Electromagnetic Excitation Resonant Sensor Based on Microelectromechanical System

Zhao

2015

TELKOMNIKA

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“…[ 1 ]. Depending on the detection mechanisms, these microsensors can be classified into capacitive pressure sensors [ 2 , 3 ], piezoelectric pressure sensors [ 4 , 5 ], piezoresistive pressure sensors [ 6 , 7 ] and resonant pressure sensors [ 8 ]. Compared to the non-resonant pressure sensors, resonant pressure sensors present the advantage of “quasi-digital” output, which allows easy coupling to digital electronics and thereby results in high resolution and reliability.…”

Section: Introductionmentioning

confidence: 99%

A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

Luo

Chen

Wang

et al. 2014

Sensors

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This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this paper. In this device, the pressure under measurement causes a deflection of a pressure-sensitive silicon square diaphragm, which is further translated to stress build up in “H” type doubly-clamped micro resonant beams, leading to a resonance frequency shift. The device geometries were optimized using FEM simulation and a 4-inch SOI wafer was used for device fabrication, which required only three photolithographic steps. In the device fabrication, a non-evaporable metal thin film as the getter material was sputtered on a Pyrex 7740 glass wafer, which was then anodically bonded to the patterned SOI wafer for vacuum packaging. Through-glass via holes predefined in the glass wafer functioned as the electrical interconnections between the patterned SOI wafer and the surrounding electrical components. Experimental results recorded that the Q-factor of the resonant beam was beyond 22,000, with a differential sensitivity of 89.86 Hz/kPa, a device resolution of 10 Pa and a nonlinearity of 0.02% F.S with the pressure varying from 50 kPa to 100 kPa. In addition, the temperature drift coefficient was less than −0.01% F.S/°C in the range of −40 °C to 70 °C, the long-term stability error was quantified as 0.01% F.S over a 5-month period and the accuracy of the microsensor was better than 0.01% F.S.

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“…By contrast, the long-term drift of resonant pressure sensors primarily arises from the mechanical property changes of the resonators. It is well accepted that the accuracy and stability of well-designed resonant pressure sensors are an order of magnitude better than those of piezoresistive pressure sensors and capacitive pressure sensors [ 3 ].…”

Section: Introductionmentioning

confidence: 99%

“…Glass tube evacuation technology was used in the RPT Series products made by GE Druck [ 4 – 6 ]. Silicon direct fusion bonding technology was used in the 8000 Series products made by GE Druck [ 3 ] and in the P90 sensors made by Thales Avionics [ 7 ]. A unique process that was specially developed by Yokogawa Electric employed selective epitaxial growth, selective anisotropic etching and hydrogen evacuation technology [ 8 , 9 ].…”

Section: Introductionmentioning

confidence: 99%

“…Moreover, there are still other vacuum packaged resonant pressure sensors [ 17 – 20 ], including designs that use getter materials [ 21 ]. Although these sensors achieve high performance levels, often with 0.01% full scale (FS) overall measurement accuracy for a high Q-factor on the order of 10 4 [ 3 , 5 , 8 ], the vacuum packaging of resonant pressure sensors is very complex and fairly costly.…”

Section: Introductionmentioning

confidence: 99%

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A Micromachined Pressure Sensor with Integrated Resonator Operating at Atmospheric Pressure

Ren

Yuan

Qiao

et al. 2013

Sensors

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Abstract:A novel resonant pressure sensor with an improved micromechanical double-ended tuning fork resonator packaged in dry air at atmospheric pressure is presented. The resonator is electrostatically driven and capacitively detected, and the sensor is designed to realize a low cost resonant pressure sensor with medium accuracy. Various damping mechanisms in a resonator that is vibrating at atmospheric pressure are analyzed in detail, and a formula is developed to predict the overall quality factor. A trade-off has been reached between the quality factor, stress sensitivity and drive capability of the resonator. Furthermore, differential sense elements and the method of electromechanical amplitude modulation are used for capacitive detection to obtain a large signal-to-noise ratio. The prototype sensor chip is successfully fabricated using a micromachining process based on a commercially available silicon-on-insulator wafer and is hermetically encapsulated in a custom 16-pin Kovar package. Preliminary measurements show that the fundamental frequency of the resonant pressure sensor is approximately 34.55 kHz with a pressure sensitivity of 20.77 Hz/kPa. Over the full scale pressure range of 100-400 kPa and the whole temperature range of −20-60 °C, high quality factors from 1,146 to 1,772 are obtained. The characterization of the prototype sensor reveals the feasibility of a resonant pressure sensor packaged at atmospheric pressure.

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Advances in Silicon Resonant Pressure Transducers

Cited by 39 publications

References 2 publications

Research on Electromagnetic Excitation Resonant Sensor Based on Microelectromechanical System

Research on Electromagnetic Excitation Resonant Sensor Based on Microelectromechanical System

A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

A Micromachined Pressure Sensor with Integrated Resonator Operating at Atmospheric Pressure

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