The development of thermally conductive polymer composites
(TCPCs)
of high filler loads holds great promise for thermal management in
electronics and power systems. However, achieving high filler loads
in TCPCs is still a great challenge because of the processing difficulties
for the traditional melt blending or solution mixing methods. Herein,
we proposed a scalable methodology to fabricate high-performance polymer-infiltrated
boron nitride nanosheet (BNNS) composite films embedded with high
filler loads for efficient thermal management. The polymer-infiltrated
BNNS films exhibited excellent heat conduction performance, and the
maximal in-plane thermal conductivity was as high as 20.65 W/(m·K),
which was increased by 258% compared to that of the conventional BNNS/PU
films with the identical BNNS content. Moreover, the polymer-infiltrated
BNNS films also showed high electrical insulation, good mechanical
performance, and excellent thermal stability. More importantly, the
polymer-infiltrated BNNS films were demonstrated to have strong heat
dissipation capability for thermal management in high-power light-emitting
diode modules and power batteries. The findings provide valuable guidance
for developing advanced TCPCs with high filler loads for thermal management.
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