A previous study showed that Cu can be cold sprayed onto carbon fiber-reinforced polymers (CFRPs) if a Cu interlayer is deposited prior to low-pressure cold spraying. In this present study, Cu was cold sprayed onto CFRP substrates that were coated with either Sn (cold spray) or Ni electroplating. Two layers of Cu powder were also cold sprayed onto a Cu-plated CFRP substrate to investigate the effect of a second particle layer on impacting particles. Test results showed that the relative hardness between the particle and substrate has a major effect on deformability, impact mode, and deposition efficiency (DE), which explains why Cu could not be cold sprayed onto Sn or Ni interlayers and why the deposition efficiency of Cu-on-Cu substrates is lower than that of one pass spraying. In summary, the results suggest that Cu can be successfully cold sprayed at low pressures onto electroplated Cu due to their similarity in hardness.
Direct cold spray deposition of Cu was not possible on carbon fiber-reinforced polymer composites (CFRPs) with thermosetting polymer as the matrix material due to substrate erosion. In a recent study, an epoxy-CFRP was successfully metallized through a hybrid coating process that involves three consecutive coating steps: (i) electroless deposition, followed by (ii) electrodeposition, and finally (iii) cold spray. In this present study, for the reduction of the coating process steps, a duplex metallic coating was developed on an epoxy-CFRPs by cold spray deposition of tin (Sn) to fabricate a continuous metallic interlayer, followed by Cu electrodeposition (i.e., SnCS-CuEP). The tensile adhesion bond strength and the electrical resistivity of the duplex coating were investigated. It was found that cold-sprayed Sn coating failed adhesively in the absence of the electrodeposited Cu coating. After the electrodeposition of Cu, cohesive failure of the cold-sprayed Sn coating took place. A “dissolution-deposition” mechanism has been established to explain the cohesive failure of the coldsprayed Sn coating after electrodeposition. The cohesive strength of the Sn coating is slightly higher than that of the previously fabricated three-step coating system. The electrical conductivity of the electrodeposited Cu coating was found to be 90% of bulk Cu. These results suggest that a duplex SnCS-CuEP coating can be fabricated on epoxy-CFRPs with relatively high electrical conductivity and slightly enhanced adhesion properties as compared to multilayered coatings fabricated using a three-step electroless deposition-electrodeposition-cold spray process.
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