Pull-off Testing and Electrical Conductivity of Sn-Based Metal Powder Mixtures Cold Sprayed on Carbon Fiber-Reinforced Polymers

Liberati, Andre C.; Che, Hanqing; Fallah, Panteha; Vo, Phuong; Yue, Stephen

doi:10.1007/s11666-022-01405-0

Cited by 7 publications

(3 citation statements)

References 55 publications

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“…Cold spray (CS) particle deposition, also known as cold gas dynamic spray or cold spray additive manufacturing, is an emerging solid-state material consolidation technology for rapid metallization on target surfaces owing to its high deposition rate, strong adhesion strength, and low operating temperatures. ,,, In CS, the particle deposition is performed below the melting point of the sprayed feedstock material so that the process can avoid oxidation, minimize thermal degradation, and consume low energy without a need of high-temperature explosive gases and radiation, thereby making the CS as a green and safe surface deposition technology . Traditionally, in the CS process, as shown in Figure b, the micrometer-scale metal particles (e.g., copper, tin, zinc, etc.)…”

Section: Methodsmentioning

confidence: 99%

“…21 Owing to these features, CS enables solid-state deposition of micrometer-scale metal particles on polymer surfaces with minimal risk of delamination of the plastic substrates. 22 Despite these intrinsic advantages, it remains challenging to achieve electrically conductive metallization through the solely cold spraying of hard metal particles such as copper (Cu) on thermoplastic substrates for polymer electronics applications. The reasons are (i) poor erosion resistance of polymers 23 and (ii) the polymer jetting phenomenon.…”

Section: ■ Introductionmentioning

confidence: 99%

“…Therein, the emerging cold spray (CS) surface deposition technique would confront the above-mentioned limitations of the current polymer metallization techniques owing to its unique advantages, including low process temperature, high deposition rate, and corrosion resistance . Owing to these features, CS enables solid-state deposition of micrometer-scale metal particles on polymer surfaces with minimal risk of delamination of the plastic substrates . Despite these intrinsic advantages, it remains challenging to achieve electrically conductive metallization through the solely cold spraying of hard metal particles such as copper (Cu) on thermoplastic substrates for polymer electronics applications.…”

Section: Introductionmentioning

confidence: 99%

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Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Akin,

Nath,

Jun

2023

ACS Appl. Electron. Mater.

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Selective surface metallization of insulating polymers is of particular interest in smart films, energy harvesting, and sensing applications. However, traditional polymer metallization techniques face challenges due to the need for environmentally hazardous pretreatment (e.g., strong acid etching) and costintensive palladium seeding processes, thereby limiting the largescale deployment of metallized polymers. With the advent of rapid prototyping, metallization on additively manufactured polymers drew attention in a variety of technological applications, as it enables the fabrication of low-cost electronic devices. In the current work, we deploy and evaluate a hybrid additive metallization route that can enable the fabrication of functional selective metallization on 3D-printed polymers in a rapid and eco-friendly methodology with improved electrical conductivity. The metallization route sequentially comprises (1) material extrusion 3D printing, (2) cold spray metallization, and (3) electroless deposition. The resulting metal (copper) layers on the polymer surfaces are characterized in terms of the microstructure, surface chemistry, wettability, and electrical conductivity. Notably, selective metallization with promising electrical conductivity (i.e., 6.47 × 10 6 S m −1 for ABS and 5.27 × 10 6 S m −1 for PLA parts) is achieved on both linear and curvilinear polymer surfaces. Moreover, strong adhesion between the metallized layer and the 3Dprinted structures was confirmed by adhesion tests. Detailed evaluation of the proposed hybrid metallization route unlocks great potential to advance the field of conductive surface metallization on 3D-printed polymers.

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