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The accurate long-range forecast of southwest rainfall can have manifold benefits for the country, from disaster mitigation and town planning to crop planning and power generation. In this paper, the rainfall has been modeled using artificial neural network (ANN) with different network configurations. Performance of these networks are compared with some results found in the literature. The networks have also been tested for the data outside the range of the trained data and compared with known results. The present network is found to be better in term of predictions than the previous results by others. Southwest monsoon rainfall over India for 6 years in advance has been predicted.

This article uses powerful technique of artificial neural network (ANN) models to simulate and estimate structural response of two-storey shear building by training the model for a particular earthquake. The neural network is first trained for a real earthquake data and the numerically generated responses of different floors of two-storey buildings as the training patterns. Trained ANN architecture is then used to simulate and test the structural response of different floors for various intensity earthquake data and it is found that the predicted responses given by ANN model are good for practical purposes. It is worth mentioning that although the simulation is done with numerically generated response data for particular earthquake, the idea may also be used for actual experimental (response) data.

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Piezoelectric MEMS (Micro-Electro-Mechanical Systems) are used in many applications now a day's including the diagnosis of diseases.COVID-19 is a pandemic recently affecting the entire world. Various techniques for detection are being used to date. Paper presents a simulation-based piezoelectric MEMS detection method for the virus, which is fast, portable, cost-effective, require less amount of sample, reliable, and can diagnose the stage for SARS-CoV-2(Severe acute respiratory syndrome corona virus 2) from the first day of virus infection. The design and analysis of cantilever-based MEMS biosensor is done COMSOL Multiphysics. Three cantilevers are used in the design, one each for viral load, IgM, and IgG. The bio-molecular reaction on the cantilever increases the mass at the end, changing the electrical and mechanical properties in the cantilever. Piezoelectric material generates the voltage proportional to the mass applied. From the values of voltage obtained from three cantilevers, the infection stage for symptomatic and asymptomatic can be diagnosed. Results show a linear relationship between the load applied and voltage generated. The proposed biosensor has a mass sensitivity of 20 copies /ml.

This paper discusses the design of a wafer level package on board for 5GHz data transmission. The design is based on the 2005 node of the International Technology Roadmap on Semiconductors (ITRS) that predicts a clock frequency of SGHz, power of 170W and an operating voltage of 0.9V for high-end microprocessors. The goal of this paper is to demonstrate the ability to support global interconnections on the board at a speed comparable to the clock frequency and supply adequate power to the chip. This requires careful design of the topology of the interconnections, control of the eddy current losses in Silicon, control of the conductor and dielectric losses in the board and design of the transition between the chip and the board. The electrical design process is discussed in detail using a test vehicle, in this paper. The test vehicle consists of Co-planar waveguide (CPW) lines on high resistivity Silicon Substrate connected to CPW lines on low k, low loss board. The transition between the chip and board is completed through solder bumps with 50um diameter and IOOum pitch. Both the Silicon and Board transmission lines have been characterized using TDR measurements. In addition, the inductance of the solder humps have been extracted. Using synthesized models extracted from measurements, the eye diagrams for 5GHz data transmission has been simulated to show the importance of losses for lmm long Silicon lines connected to 5cm long board lines through low inductance solder bumps. In addition, the effect of underfill and curing on signal propagation have been quantified.