Porurrietcrs c![fictirig (lie p " t i c eleriieiits of ci Lead-orz-Chip (LOC) Tliirz-Sriinll-OirtliriePackage (TSOP) 'were sttitlieti hy riiotleliiip uith a TI iriterricrl RLC crtrnctor arid riieasitrwiierit technique rtsirig a Vector Network Analyzer (\"A). \70rYtrtiori irz the Resistnrice ( R ) , lriditctpricr ( L ) coid Capacitarice ( C ) of a TSOP with respect to charzges iri the lead rliriierisioris I t w e clssessed Oy riiodelirrg with a lirze-&-space pattern hnsecl on the TSOP georiietry. The effect on KLC d i r e to chc~ripes iii the lecid-to-pimind separation, electrictrl properties 01 the ritaterials arid freqirericy it:ere czssessetl by riiocfehg btrsrd or1 a 54Pirz TSOP applied to 64MOX16 SDRAM. Measiil-eFnerzt was n7ade to corlfirrn the ,fiqiirricy tfepcrrderzcv of RLC ,for Alloy42 (A42), Copper (Cic) arid Pallczdirtrii plated Copper (Pd/Cu) CIS leadfraiize iimtri~icil. Sori~e,friridnriierrtnls.for packagirig desigri 0i.e srriiiiiiarized. For instarice, L caii be reditced bji increasing lead u.it/th tilit/ t/ecwctsirig /ead-io-gi~oitricf separation sirnrt/tcrrieous!\.. hi frequency stdies, it is ,foltnd that A42 ieadfiariie Iicis (I l i i ,~l t r r~r~(~~~~t f~i i c y dr/el'rritlerzc.y of R arid L. Tlziis. electriccllly inferior to those of Cu arid Pd/Cir .
A new a p p r o a c h f o r t h e f a b r i c a t i o n of Peameable Base T r a n s i s t o r s (PBT) has been r e a l i z e d w i t h s i l i c o n , T h i s a p p r o a c h u s e s h i g h l y a n i s o t r o p i c o r i e n t a t i o n d e p e n d e n t chemic a l e t c h t o f o r m U-grooves i n s i l i c o n and s e l fa l i g n e d metal e v a p o r a t i o n t o form emitter cont a c t and base Schottky barrier. A new submicron technique, capable of f a b r i c a t i n g m i c r os t r u c t u r e s w i t h a few hundred angstrom dimensions, has been developed and used to meet t h e dimensional requirement for PBT. Computer s i m u l a t i o n of t h e new PBT s t r u c t u r e s i n d i c a t e s t h e r e i s no s i g n i f i c a n t d i f f e r e n c e i n p e r f o rmance from the previous structures with embedded base.
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