This paper proposes a new test data compression/decompression method for systems-on-a-chip. The method is based on analyzing the factors that influencetest parameters: compression ratio, area overhead and test application time. To improve compression ratio, the new method is based on a Variable-length Input Huffman Coding (VIHC), which fully exploits the type and length of the patterns, as well as a novel mapping and reordering algorithm proposed in a pre-processing step. The new VIHC algorithm is combined with a novel parallel on-chip decoder that simultaneously leads to low test application time and low area overhead. It is shown that, unlike three previous approaches [2, 3, 10] which reduce some test parameters at the expense of the others, the proposed method is capable of improving all the three parameters simultaneously. For example, the proposed method leads to similar or better compression ratio when compared to frequency directed run-length coding [2], however with lower area overhead and test application time. Similarly, there is comparable or lower area overhead and test application time with respect to Golomb coding [3], with improvements in compression ratio. Finally, there is similar or improved test application time when compared to selective coding [10], with reductions in compression ratio and significantly lower area overhead. An experimental comparison on benchmark circuits validates the proposed method.

This paper presents a new compression method for embedded core-based system-on-a-chip test. In addition to the new compression method, this paper analyzes the three test data compression environment (TDCE) parameters: compression ratio, area overhead and test application time, and explains the impact of the factors which influence these three parameters. The proposed method is based on a new Variable-length Input Huffman Coding scheme, which proves to be the key element that determines all the factors that influence the TDCE parameters. Extensive experimental comparisons show that, whencompared to three previous approaches [1][2][3], which reduce some test data compression environment's parameters at the expense of the others, the proposed method is capable of improving on all the three TDCE parameters simultaneously.

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Abstract

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This paper proposes a new test data compression/decompression method for systems-on-a-chip

No abstract

Abstract