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Polycrystalline silicon is deposited by pyrolysis of silane in an rf heated epitaxial reactor. The grains exhibit a fibrous microstructure having an 〈110〉 preferred orientation in the growth direction. Growth is inhibited in the presence of excess arsine and accelerated in the presence of diborane. The results are explained in terms of catalysis and poisoning of surface adsorption sites responsible for reaction. A simple model for current conduction in polycrystalline silicon is described based on grain size, grain doping, and effective barrier height due to the grain boundary. This model satisfactorily explains the observed temperature dependence of the resistivity of undoped films and also the large values of resistivity which are observed for dopant concentrations ≲1015 cm−3 .