Hybrid OECB (Opto-Electrical Circuit Boards) are expected to make a significant impact in the telecomm switches arena within the next five years, creating optical backplanes with high speed point-to-point optical interconnects. The critical aspect in the manufacture of the optical backplane is the successful coupling between VCSEL (Vertical Cavity Surface Emitting Laser) device and embedded waveguide in the OECB. Optical performance will be affected by CTE mismatch in the material properties, and manufacturing tolerances. This paper will discuss results from a multidisciplinary research project involving both experimentation and modelling. Key process parameters are being investigated using Design of Experiments and Finite Element Modelling. Simulations have been undertaken that predict the temperature in the VCSEL during normal operation, and the subsequent misalignment that this imposes. The results from the thermomechanical analysis are being used with optimisation software and the experimental DOE (Design of Experiments) to identify packaging parameters that minimise misalignment. These results are also imported into an optical model which solves optical energy and attenuation from the VCSEL aperture into, and then through, the waveguide. Results from the thermomechanical and optical models will be discussed as will the experimental results from the DOE.
the 1' ' or 2"d generation solutions provides a complete low-cost technology that would enable fully The Of (opto-E1ectrical Circuit interconnected optical backplane architectures. Therefore there is a need for 3rd generation technology.
AbstractBoards) is expected to make a significant impact in the telecomm switches arena within the next five years. This will create optical backplanes with high speed point-topoint optical interconnects. The crucial aspect in the manufacturing process of the optical backplane is the successful coupling between VCSEL (Vertical Cavity Surface Emitting Laser) device and embedded waveguide in the OECB. Optical signals travelling through the backplane system are directly affected by CTE mismatch in the material properties. They are also dependent on the accurate placement of components and machined tolerances during the manufacturing process. This paper features results from a multidisciplinary research project involving both experimentation and modelling. Key process parameters are being investigated using DOE (Design of Experiments) and multi-physics Finite Element Modelling. Computational simulations have been undertaken to predict the localised temperature in the VCSEL during normal operation, and the subsequent thermo-mechanical misalignment that this imposes.The results from the thermo-mechanical analysis are being used in a purely optical model, which solves optical energy and attenuation from the VCSEL aperture into, and then through, the waveguide. Results from the two models are being investigated using the DOE analysis to identify packaging parameters that minimise misalignment. This is achieved via a specialist optimisation software package. Results from the thermomechanical and optical models will be discussed as will the experimental results from the DOE.
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