Mathematical modelling: a laser soldering process for an optoelectronics butterfly package

Gwyer, D.; Bailey, C.; Pericleous, K.; Philpott, D.; Misselbrook, P.

doi:10.1109/itherm.2002.1012447

Cited by 4 publications

(1 citation statement)

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“…The second approach is to diffract the laser beam so that it only applies energy to the pads. Table 2 The model predicts the laser beam hitting the component using a Gaussian heat source [5]. Heat is then dimtsed throughout the body of the device by conduction.…”

Section: Figure 2 Butterfly Packagementioning

confidence: 99%

Modelling the effect of temperature on product reliability

Bailey

Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.

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Reliability of electronic parts is a major concern for many inanufacturers. since early failures in the field can cost an enormous amount to repair -in many cases far more than the original cost of the product. A great deal of effort is expended by manufacturers to determine the failure rates for a process or the fraction of parts that will fail in a period of time. It is widely recognized that the traditional approach to reliability predictions for electronic system are not suitable for today's products. This approach, based on statistical methods only, does not address the physics governing the failure mechanisms in electronic systems. This paper discusses virtual prototyping technologies which can predict the physics taking place and relate this to appropriate failure mechanisms. Simulation results will illustrates the effect of temperature on the assembly process of an electronic package and the lifetime of a flip-chip package.

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Section: Figure 2 Butterfly Packagementioning

confidence: 99%