Experimental data confirm the utility of the following simple equation in predicting the spin coating behavior of polyimide precursor solutions: in which c PI h k t =time, and: w h = CPokP1wP2tP3 (1) = polymer solution solids weight fraction: = fitted coefficient (Greek letter beta); = film thickness after cure or solvent removal: = polymer solution kinematic viscosity, centistokes; = wafer spin speed, rpm (Greek letter omega). SPIN SPEED WAFER < VISCOUS DRAG > CENTRIFUGAL FORCE I POLYMER ! SOLUTION WAFER h = FILM THICKNESS AT TIME t dh = DIFFERENTIAL FILM THICKNESS OF A FLUID ELEMENT m. I. Fluid mechanics, viscous laminarflow.
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