We prepared two types of polyimides containing T8 cages in the main chains by polymerization of para-substituted bis(3-aminopropyl)hexaisobutyl-substituted T8 cage, and studied their mechanical, thermal, and optical properties.
Solvent-based deposition techniques
for fabrication of organic
field-effect transistors (OFETs) generally require orthogonal solvents
for deposition of a conjugated polymer layer on a polymer gate insulator
layer. Here, we found significantly reduced dissolution rate of the
polymeric film in the same solvent after casting a homegeneous polymerization
solution of para-bis(3-aminopropyl)hexaisobutyl-substituted
T8 cage (1) with terephthalaldehyde. The limited
dissolution rate in the solvent provided enough chance for fabrication
of a regioregular poly(3-hexylthiophene-2,5-diyl) (P3HT) layer on
the present polymer films without using an orthogonal solvent. The
rheological properties indicate that physical interaction between
the polymer chains provides the significantly reduced dissolution
rate after the deposition onto a substrate without any cross-linking
treatments.
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