Many physical phenomena are described by first-order differential equations whose solution is an exponential decay. Determining the time constants and amplitudes of exponential decays from the experimental data is a common task in semiconductor physics (deep level transient spectroscopy), biophysics (fluorescence decay analysis), nuclear physics and chemistry (radioactive decays, nuclear magnetic resonance), chemistry and electrochemistry (reaction kinetics) and medical imaging. This review article discusses the fundamental mathematical limitations of exponential analysis, outlines the critical aspects of acquisition of exponential transients for subsequent analysis, and gives a comprehensive overview of numerical algorithms used in exponential analysis. In the first part of the article the resolution of exponential analysis as a function of noise in input decays is discussed. It is shown that two exponential decays can be resolved in a transient only if the ratio of their time constants is greater than the resolution limit, which can be explicitly calculated from the signal-to-noise ratio in the transient. Although the signal-to-noise ratio is generally limited by the sensitivity of the equipment, it is shown that digitalization of the decays may be a major source of noise. The requirements for type of analog-to-digital converter, number of digitized data points and duration of digitized transients, which must be met to obtain the theoretical resolution limit and to improve stability of the exponential analysis, are formulated. The second part of the review article gives an overview and comparison of major numerical techniques of exponential analysis, such as the nonlinear least squares fit, the Prony method, the method of modulating functions, the method of moments, the Laplace–Padé approximation, the Tikhonov regularization method, the Gardner transformation, the method of maximum entropy and others.

Copper-silicide precipitates in silicon obtained after copper diffusion and quench in different liquids were studied by transmission electron microscopy and capacitance spectroscopy techniques. A correlation between the quenching rate, geometric size, and deep level spectra of the copper-silicide precipitates was established. The unusually wide deep level spectra are shown to be due to a defect-related band in the bandgap. The parameters of the band are evaluated using numerical simulations. A positive charge of copper-silicide precipitates in p-type and moderately doped n-type Si is predicted by simulations and confirmed by minority carrier transient spectroscopy measurements. Strong recombination activity of the precipitates due to attraction of minority carriers by the electric field around the precipitates and their recombination via the defect band is predicted and confirmed by the experiments. The pairing of copper with boron is shown to be an important factor determining the precipitation kinetics of the interstitial copper at room temperature.) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 132.239.1.231 Downloaded on 2014-11-18 to IP

A synchrotron radiation based x-ray microprobe analytical technique, x-ray beam induced current ͑XBIC͒, is suggested and demonstrated at the Advanced Light Source at the Lawrence Berkeley National Laboratory. The principle of XBIC is similar to that of electron/laser beam induced current with the difference that minority carriers are generated by a focused x-ray beam. XBIC can be combined with any other x-ray microprobe tool, such as the x-ray fluorescence microprobe ͑-XRF͒, to complement chemical information with data on the recombination activity of impurities and defects. Since the XBIC signal, which carries information about the recombination activity of defects in the sample, and the-XRF signal, which contains data on their chemical nature, can be collected simultaneously, this combination offers a unique analytical capability of in situ analysis of the recombination activity of defects and their chemical origin with a high sensitivity and a micron-scale spatial resolution. Examples of an application of this technique to multicrystalline silicon for solar cells are demonstrated.

Well-controlled fabrication of dislocation networks in Si using direct wafer bonding opens broad possibilities for nanotechnology applications. Concepts of dislocation-network-based light emitters, manipulators of biomolecules, gettering and insulating layers, and three-dimensional buried conductive channels are presented and discussed. A prototype of a Si-based light emitter working at a wavelength of about 1.5 microm with an efficiency potential estimated at 1% is demonstrated.

Dislocations introduced by the scratching or by the indentation of the basal and prismatic surfaces of low-ohmic unintentionally n-type doped GaN crystals were investigated by means of cathodoluminescence and transmission electron microscopy (TEM). A strong luminescence of straight segments of a-screw dislocations was observed in the temperature range of 70–420 K. The spectrum of dislocation related luminescence (DRL) consisted of a doublet of narrow lines red shifted by about 0.3 eV with respect to the band gap. TEM revealed dissociated character of the screw dislocations and the formation of extended nodes at their intersection. From the analysis of the DRL spectral doublet temperature, power and strain dependences DRL was ascribed to direct and indirect excitons bound by 1D quantum wells formed by partials and stacking fault (SF) ribbon of dissociated screw dislocation.

In this study we compare the growth of gallium oxide films by halide vapor phase epitaxy (HVPE) on various substrates under the same growth conditions. Gallium oxide films were deposited at 500 °C–600 °C on basal plane (0001) planar and patterned sapphire substrates, (0001) 2H-GaN, 4H-SiC, and 2 ¯ 01 bulk β-Ga2O3 substrates. The layers were studied by X-ray diffraction (XRD), scanning electron microscopy (SEM), and cathodoluminescence (CL) techniques. Most of the films exhibit growth features of hexagonal symmetry. Sn-doped Ga2O3 films exhibit n-type electrical conductivity. Heterojunctions composed of n-type hexagonal Ga2O3:Sn and p-type GaN:Mg demonstrate diode-like I-V characteristics and emit light under forward bias.

The growth of Ga2O3 films by halide vapor phase epitaxy on plain and cone‐shaped patterned sapphire substrates (PSS) is reported. The obtained specimens are characterized by X‐ray diffraction, transmission electron microscopy, cathodoluminescence, optical transmission spectroscopy, and current–voltage measurements. Both types of Ga2O3 layers are of reasonably high crystal qualities; their physical properties, however, are very different. Under the same conditions, the growth on plain substrates results in a continuous α‐Ga2O3 layer, whereas the growth on PSS produces a regular array of α‐Ga2O3 columns on top of the sapphire cones with the space between them filled with ε‐Ga2O3. Ga2O3 films grown on plain sapphire are insulating; in contrast, Ga2O3 films grown on PSS are conducting. It is found that the conductivity of Ga2O3 on PSS follows the Arrhenius law with the activation energy of 0.33 eV. New luminescent bands for α‐ and ε‐phases are found. Spectral components of the defect‐related luminescence for α‐ and ε‐ phases are identified.

By employing a combination of analytical tools including lock-in thermography and synchrotron-based x-ray fluorescence microscopy, transition metals have been identified at shunting locations in two types of low-cost multicrystalline silicon ͑mc-Si͒ solar cell materials: cast multicrystalline and ribbon growth on substrate ͑RGS͒. At a shunting location in the cast mc-Si cell, silver and titanium, both contact strip materials, have been identified at the shunting location, suggesting a process-induced error related to contact metallization. At a shunting location in the RGS cell, a material-specific shunting mechanism is described, involving channels of inverse conductivity type, where copper and iron are found. The possible roles of these metals in this shunting mechanism are discussed. These results illustrate the wide range of physical mechanisms involved with shunting in solar cells.