Void-free copper filling of trenches for ultralarge scale integrated interconnect structure was demonstrated by electroless deposition technique using polyethylene glycol as an inhibiting bath additive. With this electroless plating bath, the authors succeeded in demonstrating superfilling. Of particular interest is that the deposition at trench opening was nil during the filling process, while that at the bottom was very fast. This letter presents a demonstration and a proof of superfilling of trenches by electroless copper deposition.
Copper films electrodeposited from acid sulfate baths containing conventional additives used in the damascene process for the fabrication of ultralarge-scale integration interconnects were analyzed quantitatively to investigate the relation between carbon content and electrical resistivity of the deposit. In the as-deposited state, the resistivity of deposits that did not exhibit selfannealing effects in scanning ion microscope examination increased almost linearly with carbon content in the range of 0.002-0.045 wt %. The deposits that exhibited self-annealing effects showed higher resistivity values at identical carbon contents. After self-annealing, resistivity values of all deposits varied almost linearly with carbon content.
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