Evidence for “superfilling” of submicrometer trenches with electroless copper deposit

Hasegawa, Masaya; Yamachika, Noriyuki; Shacham‐Diamand, Yosi; Okinaka, Y.; Osaka, Tetsuya

doi:10.1063/1.2712505

Cited by 45 publications

(32 citation statements)

References 10 publications

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“…PEG was chosen as an inhibiting additive because its interactions with copper surfaces and electroless plating chemistries have been studied. [15][16][17][18][19][20][21] To characterize the effects of PEG on our electroless plating rate, various concentrations of PEG were used and the plating rate was measured. Clean copper surfaces were used for this experiment to reduce the transport limitations as much as possible.…”

Section: Journal Of the Electrochemical Society 156 ͑7͒ D226-d230 ͑2mentioning

confidence: 99%

“…[15][16][17][18][19][20][21] Electroless copper plating has been shown to exhibit a "superfilling" behavior analogous to the acid copper electroplating damascene process 22 using PEG as the only additive. 15 The ability to plate in the highly restricted space between pillars was an important aspect of the previous publication. 10 As plating occurs on the two pillars and the gap between them closes, it is very important that the two plating fronts merge together as much as possible.…”

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confidence: 99%

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Electroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip Connections

Osborn

Galiba

Kohl

2009

J. Electrochem. Soc.

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A fabrication technique using electroless copper deposition has been used to produce all-copper chip-to-substrate connections. This process replaces solder by electrolessly joining copper pillars on a chip and substrate. Previously, solid copper-to-copper bonding was demonstrated using a known electroless copper bath followed by low temperature annealing at 180°C for 1 h in a nitrogen environment. Although the process feasibility was demonstrated, it was inherently slow and required excessive process time. In this paper, an acceleration-suppression approach to copper plating was used to achieve a rapid deposition of high quality copper in enclosed regions. Elevated temperature was used for acceleration along with poly͑ethylene glycol͒ ͑PEG͒ suppression. High temperature increased the transport of reactants and products in spatially restricted regions, and the addition of PEG provided control of the deposition rate. This allowed a kinetically controlled deposition while still maintaining good quality copper deposits without excessive porosity. Plating rates as high 6 m/h in the spatially restricted region between mated pillars were achieved.

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Section: Journal Of the Electrochemical Society 156 ͑7͒ D226-d230 ͑2mentioning

confidence: 99%

mentioning

confidence: 99%

Electroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip Connections

Osborn

Galiba

Kohl

2009

J. Electrochem. Soc.

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“…As the outer region is plated for the positive mold, the external shape of the microproducts must deviate slightly from the designed shape [17]. On the other hand, the designed shape is accurately replicated using the negative mold, although it is difficult to completely plate the inner regions of the cavity of the mold [18]. To solve this problem, we have investigated the electroplating replication by forming a partial electrode on the negative column mold [19].…”

Section: Introductionmentioning

confidence: 99%

Production of Three-dimensional Nickel Microstructures by Electroless Plating on Through-hole-type Polymer Micromold

Mukai

Tanaka

2017

J. Photopol. Sci. Technol.

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In this study, a method to produce three-dimensional nickel microstructures by pouring an electroless plating solution into a through-hole mold made of photocurable resin is presented. Single-spiral and double-spiral models of 100-μm-diameter wires and 450-µm-long bunny models with 40-μm-thick ears at the minimum were fabricated using nickel, which was obtained from the resin mold. After the inflow plating into the through-hole resin mold, the spiral shape was found to be successfully transformed to the nickel product after the resin mold was sublimated. For the bunny model, dip plating was added after the inflow plating to the thin ears for successful transfer of original mold shape. The fine structure of the model surface suggested that the replication accuracy achieved the resolution of the optical lamination modeling.

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“…22 Reports by others have shown glyoxylic acid as reducing agent of bottom-up or direct ELD on barrier, however, there are only few reports on the anodic half reactions during ELD Cu. [23][24][25] To our knowledge, a nucleation study and comparison with formaldehyde for Cu electroless deposition on Ru has not yet been reported. Recently, Yu et al studied half reaction of glyoxylic acid based ELD Cu on Cu.…”

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confidence: 99%

Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent

Inoue

Philipsen

Veen

et al. 2014

J. Electrochem. Soc.

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Glyoxylic acid is seen as a promising candidate to replace formaldehyde as reducing agent in electroless Cu baths. For deposition on ruthenium, the anodic reaction of glyoxylic acid has been evaluated and compared to formaldehyde using linear sweep voltammetry. Significant differences were observed for the deposition of copper on ruthenium. First of all, a faster nucleation was inferred from open-circuit potential measurements, which is beneficial as it reduces the total process time. Secondary, we found 2,2 bipyridyl worked as stabilizer and brightener in this glyoxylic acid-based electroless bath. Thirdly, the purity of the copper films improved when 2,2 bipyridyl was present in the solution. Using the optimized composition, we demonstrate a conformal Cu seed layer deposition (∼100 nm) inside high aspect ratio (16.7) through-Si vias. This work shows the feasibility for electroless Cu seeding in a through-Si via metallization sequence.

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Evidence for “superfilling” of submicrometer trenches with electroless copper deposit

Cited by 45 publications

References 10 publications

Electroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip Connections

Electroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip Connections

Production of Three-dimensional Nickel Microstructures by Electroless Plating on Through-hole-type Polymer Micromold

Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent

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