Although phase-change memory (PCM) offers promising features for a ‘universal memory’ owing to high-speed and non-volatility, achieving fast electrical switching remains a key challenge. In this work, a correlation between the rate of applied voltage and the dynamics of threshold-switching is investigated at picosecond-timescale. A distinct characteristic feature of enabling a rapid threshold-switching at a critical voltage known as the threshold voltage as validated by an instantaneous response of steep current rise from an amorphous off to on state is achieved within 250 picoseconds and this is followed by a slower current rise leading to crystallization. Also, we demonstrate that the extraordinary nature of threshold-switching dynamics in AgInSbTe cells is independent to the rate of applied voltage unlike other chalcogenide-based phase change materials exhibiting the voltage dependent transient switching characteristics. Furthermore, numerical solutions of time-dependent conduction process validate the experimental results, which reveal the electronic nature of threshold-switching. These findings of steep threshold-switching of ‘sub-50 ps delay time’, opens up a new way for achieving high-speed non-volatile memory for mainstream computing.
Phase change memory (PCM) offers remarkable features such as high-speed and non-volatility for universal memory. Yet, simultaneously achieving better thermal stability and fast switching remains a key challenge. Thus, exploring novel materials with improved characteristics is of utmost importance. We report here, a unique property-portfolio of high thermal stability and picosecond threshold switching characteristics in In3SbTe2 (IST) PCM devices. Our experimental findings reveal an improved thermal stability of amorphous IST compared to most other phase change materials. Furthermore, voltage dependent threshold switching and current-voltage characteristics corroborate an extremely fast, yet low electric field threshold switching operation within an exceptionally small delay time of less than 50 picoseconds. The combination of low electric field and high speed switching with improved thermal stability of IST makes the material attractive for next-generation high-speed, non-volatile memory applications.
Phase change materials exhibit threshold switching (TS) that establishes electrical conduction through amorphous material followed by Joule heating leading to its crystallization (set). However, achieving picosecond TS is one of the key challenges for realizing non-volatile memory operations closer to the speed of computing. Here, we present a trajectory map for enabling picosecond TS on the basis of exhaustive experimental results of voltage-dependent transient characteristics of Ge2Sb2Te5 phase-change memory (PCM) devices. We demonstrate strikingly faster switching, revealing an extraordinarily low delay time of less than 50 ps for an over-voltage equal to twice the threshold voltage. Moreover, a constant device current during the delay time validates the electronic nature of TS. This trajectory map will be useful for designing PCM device with SRAM-like speed.
Herein, eight uniform optical states (3 bit) are demonstrated by irradiating nanosecond laser pulses on thin In3SbTe2 films having high stability (260 °C), revealing at least 1% reflectivity contrast between any two consecutive states with strikingly low noise variation of 0.18% at each level, which is almost a 50% lower value compared to Ge2Sb2Te5 and AgInSbTe materials, revealing the two times enhanced signal‐to‐noise ratio of the In3SbTe2 material. Furthermore, a systematic structural evolution during multilevel switching is investigated using confocal Raman spectroscopic studies. The experimental findings demonstrate low‐noise yet highly stable multilevel switching toward the development of reliable phase change photonic memory devices.
Chalcogenide-based Ge15Te85 thin films have recently been explored for ovonic threshold switching (OTS) selector devices for vertically stackable cross-point memory applications. Despite reasonable understanding over its crystallization kinetics and threshold switching properties, the structural stability and morphological acquaintance at elevated temperatures remain key challenges. In this paper, we investigate the thermal stability, surface morphology and local structure of as-deposited amorphous Ge15Te85 thin film starting from room temperature up to 325 °C. Our experimental results reveal that upon heating, the de-vitrification is initiated in the form of localized segregation of Te atoms at 120 °C, followed by crystallization of Te at ~220 °C and GeTe at ~263 °C as corroborated by temperature-dependent measurements of electrical resistance, x-ray diffraction and scanning electron microscopic studies. Furthermore, the crystalline areas of these films are characterized by the fine-grained morphology, which clearly distinguishes the segregation of crystallization of Te and GeTe microstructures. These findings elucidate a deeper understanding of the multi-phase crystallization process through morphological evidence, which will be useful towards optimization of materials for OTS selector applications.
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