In recent years, simulation techniques have emerged as useful tools for the design of semiconductor equipment. However, the need for rapid assessment of potential designs stretches the capability of even the most advanced tools currently available to the limit. In this paper, a simplified model of a rapid thermal processing (RTP) system that significantly reduces the execution time is presented. The model is based on a coupling of semi-analytical expressions for radiation fluxes with a one-dimensional finite element heat transfer model for wafer and slip-free ring temperatures. Results showing the effects of plate reflectivity and slip-free ring emissivity on wafer temperature are presented. It is shown that the simplified model yields results that are in agreement with detailed two-dimensional simulations of the same geometry.
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