With electronic package tends to be lighter, thinner and smaller, the stacking of the many chips in the 3-D stack packages become more and more popular package. However, the stacking of the multi-function chips in the 3-D stack packages will result in high thermal dissipation. Thermal management has turned into one of the most primary challenge of semiconductor designers. The new technology is required to remove the heat effectively. 3-D stacked package with Through Silicon Via (TSV) technology is developed for two chips in a package. Electrical connections in the silicon interposer are formed by TSV. The silicon interposer has better thermal conductivity than that without interposer, therefore the package thermal resistance is lower. In this paper, thermal evaluations on Flip-Chip Ball Grid Array (FC-BGA) packages were presented using CFD modeling technique. The evaluation topics covered impact of Through Silicon Via (TSV) and dummy bumps, various power consumption, die size and package size effects. Besides, the thermal performance of the package would be decided by thermal conductivity of under fill. Finally, thermal suggestions were concluded for designers to design in TSV arrangements to effectively dissipate hot source.
No abstract
With the demand increases in data storage capacity and high-speed data transfer rate, the controller components of Hard Disk Drive (HDD) need more power to serve the higher level of electrical function performance. Therefore, an optimal thermal design for HDD components to ensure HDD operating under safe temperature environment becomes very important for suppliers to successfully bring HDD product into market.In this study, a HDD component was attached onto a metal block that is a part of HDD body implemented to enhance thermal dissipation. Several thermal designs from component to HDD module will be addressed to achieve the chips running below industry specification of 125 o C. Firstly, two different metal block designs were evaluated with experimental analyses. Next, different screw material that uses to fasten PCB board and HDD and different thermal pad thickness that between HDD component and metal block are evaluated. Finally, different test section, ambient temperature and power consumption effect was also evaluated. After experimental analyses finished, the simulation model with a commercial Finite Differential Analysis (FDA) program, Flotherm, was conducted to find the best thermal solution for three different HDD component structures including Plastic Ball Grid Array (PBGA), BGA with Exposed Drop-in Heat Spreader and Thin Fine Pitch BGA.The conclusion of this study indicates the Thin Fine Pitch BGA package with high thermal conductivity molding compound was the optimal installation for greatest thermal benefit for HDD component. IntroductionIn recently years, as more power is applied in higher-level HDD apparatus, the manufacturers of HDD are facing very tough challenges for dissipation the heat from the HDD components.In order to investigate thermal performance for HDD module, the experimental analyses of thermal test chip technique were using evaluated thermal performance. For measurement installed, the TFBGA package that mounted on 4L PCB board was fastened to metal block by screws as shown in Figure1. Two different metal block design of Hard DriveA and Hard DriveB as shown in Figure2 were to compare their thermal dissipation ability. For Hard DriveB, there are more metal volume coverage and better screw hole design to compress perfectly to minimize the contact resistance of thermal pad. Moreover, two different screw material of metal and neylon that uses to fasten PCB board and HDD; two different thermal pad thicknesses of 35 mil and 70 mil that between HDD component and metal block; two different test sections of win tunnel that is 305 x 550 x 305 mm 3 acrylic box and closed box that is 305 x 305 x 305 mm 3
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
hi@scite.ai
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.