Abstract:With electronic package tends to be lighter, thinner and smaller, the stacking of the many chips in the 3-D stack packages become more and more popular package. However, the stacking of the multi-function chips in the 3-D stack packages will result in high thermal dissipation. Thermal management has turned into one of the most primary challenge of semiconductor designers. The new technology is required to remove the heat effectively. 3-D stacked package with Through Silicon Via (TSV) technology is developed fo… Show more
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