Cu-Mo composites have been one of candidates for material of heat-sinks in electronic devices. We obtained Cu-Mo composites by electrodeposition using CuSO 4 and Na 2 MoO 4 with trisodium citrate as complexing agent. The presence of molybdenum in Cu-Mo was demonstrated by X-ray photoelectron spectroscopy and inductively coupled plasma atomic emission spectroscopy. The molybdenum content in Cu-Mo composites depended on the concentration ratio of Na 2 MoO 4 /(Na 2 MoO 4 + CuSO 4 ) in the electrolyte, kinds and concentration of complexing agents. The mol ratio of Na 2 MoO 4 /(Na 2 MoO 4 + CuSO 4 ), from 0.75 to 0.87 provided larger molybdenum content at 0.05 A/dm 2 of electrodeposition current. The molybdenum content increased with decreasing current density during electrodeposition in the range of 0.05-0.3 A/dm 2 . Trisodium citrate was the most effective complexing agent among trisodium citrate, glycolic acid, EDTA (4Na) and combinations of them for increasing molybdenum content. The molybdenum content reached up to 22.9 wt% at 0.396 mol/dm 3 of trisodium citrate concentration. X-ray diffraction shows that no peaks related to molybdenum was observed, moreover, the intensity and the width of Cu(111) peaks decreased and enlarged with increasing molybdenum content. These indicate that the structure of molybdenum in copper-molybdenum composites was amorphous, furthermore, higher molybdenum content made copper structure close to amorphous.
Codeposition of copper and molybdenum was obtained by electroplating using CuSO 4 and Na 2 MoO 4 with trisodium citrate as complexing agent. The molybdenum content which was investigated by inductively coupled plasma atomic emission spectroscopy in electroplated Cu-Mo increased, from 0.5 to 7.1 wt%, with decreasing current density in the range from 0.1 to 1.2 A/dm 2 during electroplating. X-ray diffraction showed that the structure of molybdenum is amorphous, and higher molybdenum content gave smaller and wider Cu (111) peaks, furthermore, made the surface morphology smoother. These suggest that molybdenum atoms are introduced into copper crystal lattices, resulting in breaking copper crystal lattices.
The selective electroless deposition on metallic electrodes of a micro-passive-chip component was investigated. We performed three pretreatments: (a) alkaline degreasing, (b) acid activation, and (c) catalytic activation by the double alternate-dipping method consisting of two steps, i.e., sensitization (SnCl2) and activation (PdCl2). Catalytic conditions such as the concentration of PdCl2, activation time, and number of activation times were optimized to achieve the selectivity of electroless deposition. The mechanism of the selectivity of electroless deposition was investigated by X-ray photoelectron spectroscopy measurements. Tetravalent Sn and metallic Pd are observed on the inner electrode of the sample. On the other hand, metallic Sn and tetravalent Pd are mainly observed in certain areas except the inner electrode areas. These results indicate that the sensitization is performed well in the inner electrode region because Pd must be in a metallic state to validate its catalytic activity.
Cu–Mo composites have been expected to be materials of heat sinks in electron devices. We have formed Cu–Mo composites by electrodeposition. Molybdenum content in Cu–Mo composites formed by using Na2MoO4 was larger than that in ones formed by using H3(PMo12O40). Molybdenum content, over 30 wt % in Cu–Mo composites was obtained.
in Electrodeposited Cu-Mo Composites. -Cu-Mo composites used as heat sinks in electronic devices are electrodeposited using Ni as cathode and Pt as anode from a bath containing Na 2MoO4 or H3(PMo12O40), CuSO4, trisodium citrate, and/or EDTA, and/or glycolic acid at pH 9. Optimum conditions with 30 wt% of Mo content are obtained using Na 2MoO4 with trisodium citrate (0.396 mol dm -3 ) at 0.05 A dm -2 . -(GOTOU, M.; ARAKAWA, T.; WATANABE, N.; HARA, T.; TOMITA, T.; HASHIMOTO, A.; TAKANASHI, H.; KOIWA*, I.; Bull. Chem. Soc. Jpn. 88 (2015) 1, 173-175, http://dx.doi.org/10.1246/bcsj.20140225 ; Grad. Sch. Eng., Kanto Gakuin Univ., Kanazawa, Yokohama 236, Japan; Eng.) -J. Schramke 15-023
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