Codeposition of Copper and Molybdenum by Electroplating

Abstract

Codeposition of copper and molybdenum was obtained by electroplating using CuSO 4 and Na 2 MoO 4 with trisodium citrate as complexing agent. The molybdenum content which was investigated by inductively coupled plasma atomic emission spectroscopy in electroplated Cu-Mo increased, from 0.5 to 7.1 wt%, with decreasing current density in the range from 0.1 to 1.2 A/dm 2 during electroplating. X-ray diffraction showed that the structure of molybdenum is amorphous, and higher molybdenum content gave smaller and wider Cu (111) peaks, furthermore, made the surface morphology smoother. These suggest that molybdenum atoms are introduced into copper crystal lattices, resulting in breaking copper crystal lattices.

Copper-Molybdenum Source Ratio and Complexing Agent for High Molybdenum Content in Electrodeposited Cu-Mo

“…26 We have developed Cu-Mo composites by electrodeposition. 10 Molybdenum content increased to 7.1 wt% with decreasing current density during electrodeposition using trisodium citrate as complexing agent. 10 In the present work, we describe the effect of the mol ratio of Na 2 MoO 4 /(Na 2 MoO 4 + CuSO 4 ), furthermore kinds and concentration of complexing agents in electrolytes on molybdenum content in Cu-Mo composites in order to increase molybdenum content in Cu-Mo composites.…”

“…10 Molybdenum content increased to 7.1 wt% with decreasing current density during electrodeposition using trisodium citrate as complexing agent. 10 In the present work, we describe the effect of the mol ratio of Na 2 MoO 4 /(Na 2 MoO 4 + CuSO 4 ), furthermore kinds and concentration of complexing agents in electrolytes on molybdenum content in Cu-Mo composites in order to increase molybdenum content in Cu-Mo composites. Cu-Mo composites are required to include more than 15 wt% of molybdenum content for application of heat-sinks or heat spreaders above mentioned.…”

“…9 In contrast, our approach to the preparation of Cu-Mo composites is electrodeposition. 10 Yousif et. al.…”