Recently, flexible thermoelectric generator (FlexTEG) modules using organic or thin film materials have gained much attention due to their potential applications for, for example, wireless sensors and wearable power. However, the performance of these modules is poor and still far from the requirement for energy harvesting. Here, the traditional semiconductor packaging technique is adapted to fabricate a large‐scale FlexTEG, for use in energy harvesting on both planar and nonplanar surfaces. The module uses high‐performance bismuth‐telluride p‐ and n‐type chips on a flexible thin plastic substrate. Using a unique isotropic design for mounting the chips, a FlexTEG module consisting of 250 p‐n pairs is successfully fabricated on a 50 × 50 mm2 flexible substrate. The output power, mechanical strength, and bending properties are investigated at different temperature gradients and bending cycles. The module exhibits a maximum output power density of 158 mW cm−2 at dT = 105 K, corresponding to an efficiency value of 1.84%, which is comparable to a conventional bulk TEG. Mechanical tests reveal that the flexible module is reliable and stable during bending. These results open great potential for applications in portable, wearable, or implantable electronic devices.
Among the several flexible thermoelectric modules in existence, sintered Bi-Te-based modules represent a viable option because of their high output power density and flexibility, which enables the use of arbitrary heat sources. We have fabricated Bi-Te-based modules with a large-scalable fabrication process and improved their output performance. The reduction in the interconnection resistance, using thick electrodes of the flexible printed circuit, significantly improves the module's output power to 87 mW/cm 2 at ∆T = 70 K, which is 1.3-fold higher than a previous prototype module. Furthermore, the establishment of the fabrication for the top electrodes by using the surface mount technology makes it possible to realize a high-throughput manufacturing of the module. Our durability tests reveal that there is no significant change in the internal resistance of the module during 10000 cycles of mechanical bending test and 1000 cycles of thermal stress test.
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