No abstract

No abstract

This paper presents an approach to describe abilities of manufacturing resources by a formal description of capabilities using Semantic Web technologies. A hierarchical ontology architecture is proposed to represent, publish, and extend knowledge on capabilities for different application domains and use cases. Furthermore, the paper describes patterns of how the underlying formal logic can be used in taxonomy modeling and the inference of implicit capability facts. The usability and performance of the approach was validated by formalizing capability knowledge of related work and evaluated in benchmarking a prototypical implemented tool for managing and querying catalogs of resources and their capabilities. The proposed concept is intended to be used as a foundation for a future multi-layered feasibility checking, which evaluates the compatibility of resources and their offered skills with the requirements of manufacturing tasks at symbolic and subsymbolic levels. Extended evaluations might be based on parameters, analytics, simulation, and other means.

No abstract

In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical resistance. The nanopowder was added at a rate of 10% by weight and then mechanically mixed until homogenous solder paste was obtained. The results showed that the addition of Sn nanoparticles resulted in homogenous bond formation for SAC-3 and SCAN, while voids and bubbles formation slightly increased within the joint interface for the water washable solder paste. The SCAN + Sn nano reinforced solder paste showed increased variation of joint strength from 12.6 to 39.9 N, while the water washable + Sn nanopowder reinforced solder paste showed less variability in joint strength from 17.3 to 33.9 N. Both sets of solder paste with and without Sn nano reinforced solder paste showed a reliable quality joint under mechanical shock testing after six shocks in six milliseconds with an 87.1 ms pulse duration. The results showed that Sn nanoparticles resulted in a small resistance change, while RDC values (in mΩ) slightly decreased for SAC and increased for SCAN and further increases for water washable solder paste.