Articles you may be interested inAccurate noncontact calibration of colloidal probe sensitivities in atomic force microscopy Rev. Sci. Instrum. 80, 065107 (2009); 10.1063/1.3152335 SI traceable calibration of an instrumented indentation sensor spring constant using electrostatic force Rev. Sci. Instrum. 79, 095105 (2008); 10.1063/1.2987695Silicon nanowires with sub 10 nm lateral dimensions: From atomic force microscope lithography based fabrication to electrical measurements The use of critical dimension atomic force microscopes ͑CD AFMs͒ in semiconductor manufacturing, both for process control and as a reference metrology tool, is increasing. If the tip width is calibrated consistently between measurements, a CD AFM can function as an excellent width comparator. Relative widths can be measured with uncertainties of 1 nm or less. However, to perform accurate measurements, the absolute tip width must be accurately calibrated. Until recently, conventional methods for accomplishing this had standard uncertainties on the order of 5 nm. Recently developed CD reference materials now make it possible to calibrate absolute tip width with uncertainties at the 1 nm level. The highlights of our method are: ͑1͒ the use of single-crystal silicon and preferential etching to pattern well-defined and highly uniform features; ͑2͒ the use of high resolution transmission electron microscopy ͑HRTEM͒ to access the Si lattice spacing directly as a source of traceable width information, and ͑3͒ the use of CD AFM to transfer width information from the HRTEM samples. These standards are known as single crystal critical dimension reference materials ͑SCCDRM͒, and prototype SCCDRMs have recently been delivered to SEMATECH Member Companies for evaluation.
The National Institute of Standards and Technology (NIST) and SEMATECH have been working together to improve the traceability of critical dimension atomic force microscope (CD-AFM) dimensional metrology in semiconductor manufacturing. A major component of this collaboration has been the implementation of a Reference Measurement System (RMS) at SEMATECH using a current generation CD-AFM. An earlier tool, originally used at SEMATECH, has now been installed at NIST. Uncertainty budgets were developed for pitch, height, and CD measurements using both tools. At present, the standard uncertainties are approximately 0.2 % for pitch measurements and 0.4 % for step height measurements. Prior to the current work, CD-AFM linewidth measurements were limited to a standard uncertainty of about 5 nm. However, this limit can now be significantly reduced. This reduction results from the completion of the NIST/SEMATECH collaboration on the development of single crystal critical dimension reference materials (SCDDRM). A new generation of these reference materials was released to SEMATECH Member Companies during late 2004. The SEMATECH RMS was used to measure the linewidths of selected features on the distributed specimens. To reduce the uncertainty in tip width calibration, a separate transfer experiment was performed in which samples were measured by CD-AFM and then sent for high resolution transmission electron microscopy (HRTEM). In this manner, CD-AFM could be used to transfer the HRTEM width information to the distributed samples. Consequently, we are now able to reduce the limit on the standard uncertainty (k = 1) of CD-AFM width measurements to 1 nm.
This letter demonstrates a method for fabricating single-crystal Si nanolines, with rectangular cross sections and nearly atomically flat sidewalls. The high quality of these nanolines leads to superb mechanical properties, with the strain to fracture measured by nanoindentation tests exceeding 8.5% for lines of 74 nm width. A large displacement burst before fracture was observed, which is attributed to a buckling mechanism. Numerical simulations show that the critical load for buckling depends on the friction at the contact surface.
The National Institute of Standards and Technology (NIST) has a multifaceted program in atomic force microscope (AFM) dimensional metrology. There are two major instruments being used for traceable AFM measurements at NIST. The first is a custom in-house metrology AFM, called the calibrated AFM (C-AFM), and the second instrument is a commercial critical dimension AFM (CD-AFM). The C-AFM has displacement metrology for all three axes traceable to the 633 nm wavelength of the Iodine-stabilized He-Ne laser. In the current generation of this system, the relative standard uncertainty of pitch and step height measurements is approximately 1.0 ×10 -3 for pitches at the micrometer scale and step heights at the 100 nm scale, as supported by several international comparisons. We expect to surpass this performance level soon. Since the CD-AFM has the capability of measuring vertical sidewalls, it complements the C-AFM. Although it does not have intrinsic traceability, it can be calibrated using standards measured on other instruments -such as the C-AFM, and we have developed uncertainty budgets for pitch, height, and linewidth measurements using this instrument. We use the CD-AFM primarily for linewidth measurements of near-vertical structures. At present, the relative standard uncertainties are approximately 0.2 % for pitch measurements and 0.4 % for step height measurements. As a result of the NIST single crystal critical dimension reference material (SCCDRM) project, it is possible to calibrate CD-AFM tip width with a 1 nm standard uncertainty. We are now using the CD-AFM to support the next generation of the SCCDRM project. In prototypes, we have observed features with widths as low as 20 nm and having uniformity at the 1 nm level.
We demonstrate a top-down method for fabricating nickel mono-silicide (NiSi) nanolines (also referred to as nanowires) with smooth sidewalls and line widths down to 15 nm. Four-probe electrical measurements reveal that the room temperature electrical resistivity of the NiSi nanolines remains constant as the line widths are reduced to 23 nm. The resistivity at cryogenic temperatures is found to increase with decreasing line width. This finding can be attributed to electron scattering at the sidewalls and is used to deduce an electron mean free path of 6.3 nm for NiSi at room temperature. The results suggest that NiSi nanolines with smooth sidewalls are able to meet the requirements for implementation at the 22 nm technology node without degradation of device performance.
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