A two-part review of research concerning block copolymer thin films is presented. The first section summarizes experimental and theoretical studies of the fundamental physics of these systems, concentrating upon the forces that govern film morphology. The role of film thickness and surface energetics on the morphology of compositionally symmetric, amorphous diblock copolymer films is emphasized, including considerations of boundary condition symmetry, so-called hybrid structures, and surface chemical expression. Discussions of compositionally asymmetric systems and emerging research areas, e.g., liquid-crystalline and A-B-C triblock systems, are also included. In the second section, technological applications of block copolymer films, e.g., as lithographic masks and photonic materials, are considered. Particular attention is paid to means by which microphase domain order and orientation can be controlled, including exploitation of thickness and surface effects, the application of external fields, and the use of patterned substrates.

An analysis of the morphological behavior of substrate-supported diblock copolymer films for thicknesses t below the equilibrium period L 0 of the copolymer is presented. Substrate-supported films generally exhibit dissimilar interactions between the copolymer block components and the free and substrate surfaces. Accordingly, in this study, self-consistent-field calculations that incorporate asymmetric surface energetics were used to assess equilibrium film morphologies. Phase diagrams were constructed as a function of film thickness, surface interaction energies, the segmental interaction, and the chain length. In conjunction, experiments were conducted on a series of polystyrene-b-poly(n-alkyl methacrylate) copolymer films supported by silicon substrates. These employed a novel atomic force microscopy technique that allowed for the precise tracking of morphology as a function of film thickness. Comparison of the experimental results and calculations revealed several common trends. In particular, hybrid morphologies, incorporating both surface-parallel and surface-perpendicular elements, were observed both experimentally and through the calculations for the thickness regime, t ∼ 0.5L 0. The stability of such structures was found to be closely linked to the symmetry of the surface energetics.

Thickness is a governing factor in the behavior of films and coatings. To enable the high-throughput analysis of this parameter in polymer systems, we detail the design and operation of a "flow coater" device for fabricating continuous libraries of polymer film thickness over tailored ranges. Focusing on the production of model polystyrene film libraries, we thoroughly outline the performance of flow coating by varying critical factors including device geometry, device motion, and polymer solution parameters.

Residual stress, a pervasive consequence of solid materials processing, is stress that remains in a material after external forces have been removed. In polymeric materials, residual stress results from processes, such as film formation, that force and then trap polymer chains into nonequilibrium stressed conformations. In solvent-cast films, which are central to a wide range of technologies, residual stress can cause detrimental effects, including microscopic defect formation and macroscopic dimensional changes. Since residual stress is difficult to measure accurately, particularly in nanoscale thin polymer films, it remains a challenge to understand and control. We present here a quantitative method of assessing residual stress in polymer thin films by monitoring the onset of strain-induced wrinkling instabilities. Using this approach, we show that thin (>100 nm) polystyrene films prepared via spin-coating possess residual stresses of approximately 30 MPa, close to the crazing and yield stress. In contrast to conventional stress measurement techniques such as wafer curvature, our technique has the resolution to measure residual stress in films as thin as 25 nm. Furthermore, we measure the dissipation of residual stress through two relaxation mechanisms: thermal annealing and plasticizer addition. In quantifying the amount of residual stress in these films, we find that the residual stress gradually decreases with increasing annealing time and plasticizer amounts. Our robust and simple route to measure residual stress adds a key component to the understanding of polymer thin film behavior and will enable identification of more effective processing routes that mitigate the detrimental effects of residual stress.