Carbon-nanotube ͑CNT͒-based strain sensors have the potential to overcome some of the limitations in small-scale force/displacement sensing technologies due to their small size and high sensitivity to strain. A better understanding of the dominant and limiting causes of high strain sensitivity is needed to enable the design and manufacture of high-performance sensor systems. This paper presents the theoretical framework that makes it possible to predict the strain sensitivity of a carbon nanotube based on it chiral indices ͑n , m͒. This framework is extended to capture the behavior of sensors composed of multiple CNTs in a parallel resistor network. This framework has been used to predict that a parallel resistor network of more than 100 randomly selected CNTs should have a gauge factor of approximately 78.5Ϯ 0.4. This is within the experimental error of the measured gauge factor of 75Ϯ 5 for such CNT resistor networks.

One of the biggest challenges in microscale additive manufacturing is the production of three-dimensional, microscale metal parts with a high enough throughput to be relevant for commercial applications. This paper presents a new microscale additive manufacturing process called microscale selective laser sintering (μ-SLS) that can produce true 3D metal parts with sub-5 μm resolution and a throughput of greater than 60 mm 3 /hour. In μ-SLS, a layer of metal nanoparticle ink is first coated onto a substrate using a slot die coating system. The ink is then dried to produce a uniform nanoparticle layer. Next, the substrate is precisely positioned under an optical subsystem using a set of coarse and fine nanopositioning stages. In the optical subsystem, laser light that has been patterned using a digital micromirror array is used to heat and sinter the nanoparticles into the desired patterns. This set of steps is then repeated to build up each layer of the 3D part in the μ-SLS system. Overall, this new technology offers the potential to overcome many of the current limitations in microscale additive manufacturing of metals and become an important process in microelectronics packaging applications.

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