The use of CMOS nanometer technologies at 65 nm and below will pose serious challenges on the design of mixed-signal integrated systems in the very near future. Rising design complexities, tightening time-to-market constraints, leakage power, increasing technology tolerances, and reducing supply voltages are key challenges that designers face. Novel types of devices, new process materials and new reliability issues are next on the horizon. We discuss new design methodologies and EDA tools that are being or need to be developed to address the problems of designing such mixed-signal integrated systems.
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