a b s t r a c tInterfaces play a crucial role in mechanical behaviors of both laminated and gradient structured materials. In this work, copper/bronze laminates with varying interface spacing were fabricated by accumulative roll bonding and subsequent annealing to systematically study the interface effect on mechanical properties. Heterogeneities exist in chemical composition, grain size, hardness and texture across the interfaces. Simultaneous improvement of strength and ductility with decreasing interface spacing is found in tensile tests. Extra geometrically necessary dislocations (GNDs) are found to accumulate in the vicinity of interfaces, which is due to mechanical incompatibility across the interfaces. Importantly, an interface-affected zone spanning a few micrometers was found, which is not affected by interface spacing. These observations suggest the existence of an optimum spacing, which may produce the highest hardening capacity and ductility without sacrificing strength.
Graded distributions of copper particles in ultrafine-grained aluminium sheets are produced by accumulative roll bonding and particle reinforcement. The metallic copper particles are sprayed on the sheet surfaces under variation of spray distance and/or relative velocity of the spray gun to the sheet. Therewith, the particle content could be varied by a factor of three. After solutionizing, the successful gradation is clearly proven by tensile tests showing a steady and monotonous gradient along the rolling direction. By a systematic analysis of the spraying process, the particle content profile is calculated. Accuracy of the calculation is confirmed by electrical resistivity measurements. The presented method enables the production of tailored sheets by graded particle reinforcement. The graded sheets are also used for basic investigation of materials properties along graded compositions. Fig. 4. (a) Stress-strain data of aluminium alloyed with copper based on graded particle reinforcement by acceleration. (b) Photograph of graded sheet with positions of tensile specimens. (c) Calculated copper content profile with positions of tensile specimens and respective ultimate tensile strength in the solutionized state.
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