This paper presents a multi-technique approach for the purpose of recording and documentation of cultural heritage. The focal point of the study is to generate a three-dimensional (3D) model representation of a physical object and to apply orthographic projection to document the design. Three main methods are used to generate 3D objects, namely Laser Range Scanner, Depth Image Data, and Photogrammetry. A comparison analysis is designed to evaluate each method accordingly. For evaluation purposes, a case study is designed where a scale model of a 25-cm-long famous historic Portuguese Indian Armada, known as “Flor de la Mar” is selected as a sample for generating 3D model records. The comparison analysis shows that the Photogrammetry method is superior in terms of detail, precision, and visualization. On the other hand, Laser Range Scanner and Depth Image Data method can display the data into the point cloud but with less accuracy. Overall, the result shows that the Photogrammetry method achieves a strong 97.6% of accuracy in terms of dimensions and shapes.
Cheap Efficient Nursery Tank System - Recirculating Aquaculture System (CENTS-RAS) is an alternative hatchery system used in most places in Tanjung Demong Terengganu. Waste trap (Wastrap) is a system on CENTS-RAS to dispose of sewage and needs to be opened according to schedule to ensure water quality is at a good level. This requires employees to open the wastrap manually and in an orderly manner. Problems occur when the frequency does not occur regularly. Design and construction smart wastewater controlled by Programmable Logic Controller (PLC) to output electrical actuator ball valve fit in inlet water and wastrap installed in CENTS-RAS for maintaining good water quality. Disposal of dirty water as well as conversion with clean livestock water is systematically controlled based on the programmed time. Previously using manual methods for wastrap opening, fish survival and growth probably limit the production potential is around 78% -85%. After construction with smart system automatically regular scheduling with 4 time interval methods that have been set will work 24 hours a day for 50 days to ensure the conversion rate and life is high. Effectiveness water quality control were higher by implementing new design using automated methods.
Wafer fabrication technology has been seeing exponential growth in recent years. This development is driven by the demand for better reliability, superior performance, and lower cost of electronic consumer products. Generally, the standard soft-soldering wafer backside metallization multilayer stack is AuAs/Ag/Ni/Ag. The present backside metallization being developed is Ti/NiV/Ag as the cost of Ti is almost neglectable compared to Au. However, this new wafer backside metallization leads to increased remnants remaining on the dicing tape after die pickup. The reduced effective area of the die backside surface may cause adhesion issues in the subsequent die attach process. In realizing this essential phase, in pre-assembly process optimization has been carried out using some assessment on the process flow and data analysis through statistical analyses image and measurement of wafer skeleton remnants was taken showing a reduction from 70μm to 40μm in width. This method shows that skipping the baking process in the pre-assembly process will undoubtedly lessen the adhesion with the back metal with mounting tape. Without compromising the saw quality will indeed give a reduced wafer remnant. Henceforth, skipping baking in the pre-assembly process will significantly reduce wafer remnants and further improve die attach process.
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