Abstract:Wafer fabrication technology has been seeing exponential growth in recent years. This development is driven by the demand for better reliability, superior performance, and lower cost of electronic consumer products. Generally, the standard soft-soldering wafer backside metallization multilayer stack is AuAs/Ag/Ni/Ag. The present backside metallization being developed is Ti/NiV/Ag as the cost of Ti is almost neglectable compared to Au. However, this new wafer backside metallization leads to increased remnants r… Show more
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