Lighter weight multicrystalline silicon photovoltaic (PV) modules were investigated by substitution of acrylic thin film for standard glass as a cover sheet. Acrylic-film PV mini modules were fabricated with the composition determined from stress simulation results and tested for long-term reliability against thermal changes and humidity. The results revealed that the acrylic-film-cover-sheet PV module satisfied the qualifying standards of all the reliability tests in both the module appearance after tests and the electrical properties. Moreover, the PV module proved to be durable in the impact resistance test, even though the cover sheet was thinner. In addition, the electrical properties of the PV module were unaffected in the potential-induced degradation (PID) test, whereas those of the standard glass module were significantly deteriorated. These results indicated that it is possible for the lighter weight acrylic-film PV module to be used in the immediate future.
Recently there has been increased interest in using thermoplastic encapsulant materials in photovoltaic modules, but concerns have been raised about whether these would be mechanically stable at high temperatures in the field. Recently, this has become a significant topic of discussion in the development of IEC 61730 and IEC 61215. We constructed eight pairs of crystalline-silicon modules and eight pairs of glass/encapsulation/glass thin-film mock modules using different encapsulant materials, of which only two were formulated to chemically crosslink. One module set was exposed outdoors with thermal insulation on the back side in Mesa, Arizona, in the summer (hot-dry), and an identical module set was exposed in environmental chambers. High-precision creep measurements (±20 μm) and electrical performance measurements indicate that despite many of these polymeric materials operating in the melt or rubbery state during outdoor deployment, no significant creep was seen because of their high viscosity, lower operating temperature at the edges, and/or the formation of chemical crosslinks in many of the encapsulants with age despite the absence of a crosslinking agent. Only an ethylene-vinyl acetate (EVA) encapsulant formulated without a peroxide crosslinking agent crept significantly. In the case of the crystallinesilicon modules, the physical restraint of the backsheet reduced creep further and was not detectable even for the EVA without peroxide. Because of the propensity of some polymeric materials to crosslink as they age, typical thermoplastic encapsulants would be unlikely to result in creep in the vast majority of installations.
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There has been recent interest in the use of thermoplastic encapsulant materials in photovoltaic modules to replace chemically crosslinked materials, e.g., ethylene-vinyl acetate. The related motivations include the desire to: reduce lamination time or temperature; use less moisture-permeable materials; use materials with better corrosion characteristics or with improved electrical resistance. However, the use of any thermoplastic material in a high-temperature environment raises safety and performance concerns, as the standardized tests currently do not expose the modules to temperatures in excess of 85°C, though fielded modules may experience temperatures above 100°C. Here we constructed eight pairs of crystalline silicon modules and eight pairs of glass/encapsulation/glass thin film mock modules using different encapsulant materials of which only two were designed to chemically crosslink. One module set was exposed outdoors with insulation on the back side in Arizona in the summer, and an identical set was exposed in environmental chambers. High precision creep measurements (±20 J.1m) and performance measurements indicate that despite many of these polymeric materials being in the melt state during outdoor deployment, very little creep was seen because of their high viscosity, temperature heterogeneity across the modules, and the formation of chemical crosslinks in many of the encapsulants as they aged. In the case of the crystalline silicon modules, the physical restraint of the backsheet reduced the creep fu rther.
Dynamic Mechanical Loading (DML) of photovoltaic modules is explored as a route to quickly fatigue copper interconnect ribbons. Results indicate that most of the interconnect ribbons may be strained through module mechanical loading to a level that will result in failure in a few hundred to thousands of cycles. Considering the speed at which DML may be applied, this translates into a few hours of testing. To evaluate the equivalence of DML to thermal cycling, parallel tests were conducted with thermal cycling.
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