Electrodeposition behavior of Sn-Ag alloys was investigated at current density 1-1000 AÁm À2 in both sulfate and pyrophosphate-iodide solutions at 298 K, and the contact resistance of Sn-Ag alloys deposited on a Cu connector was evaluated. In both solutions, Ag behaved as a more noble metal than Sn, showing regular codeposition. The difference in deposition potential between Ag and Sn was 0.4 V in the pyrophosphate-iodide solution and 0.2 V in a sulfate solution containing thiourea as a complexing agent for Ag þ ions. The deposits obtained from a pyrophosphate-iodide solution consisted of blocks of a few microns in size, while those from a sulfate solution exhibited grains smaller than 1 mm. The deposits containing Ag less than 45 mass% were composed of an Ag 3 Sn intermetallic compound and Sn. This is in accordance with the equilibrium phase diagram of the binary Ag-Sn system. The contact resistance of deposited Sn-Ag alloys, after heating at 433 K for 120 h, was slightly smaller at Ag content below 45 mass% than that of reflow Sn plating. The connection reliability of connectors after abrasion was better in deposited films of Sn-Ag alloys than in those with reflow Sn plating.
Electrodeposition behavior of Sn Ag alloys was investigated at 1 to 1000 A/m 2 in both sulfate and pyrophosphate iodide baths of 298 K, and the contact resistance of Sn Ag alloys deposited on Cu connector was evaluated. In both baths, Ag behaved as more noble metal than Sn, showing the typical feature of regular type codeposition. The difference of deposition potential between Ag and Sn was 0.4 V in pyrophosphate iodide bath, while it was 0.2 V in sulfate bath containing thiourea as complexing agent for Ag + ions. The deposits obtained from pyrophosphate iodide bath consisted of blocks of a few micron in size, while those from sulfate bath showed grains smaller than 1 mm. The deposits containing Ag less than 45 mass were composed of Ag 3 Sn metallic compound and Sn in accordance with the equilibrium phase diagram of binary Ag Sn system. The contact resistance of deposited Sn Ag alloys after heating at 433 K for 120 hours was somewhat smaller at Ag contents less than 45 mass than that of reflow Sn plating. The connecting reliability of connector after abrasion was better in deposited films of Sn Ag alloys than in reflow Sn plating.
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