A hybrid molecular-dynamics (MD) and finite-element simulation approach is used to study stress distributions in silicon/silicon-nitride nanopixels. The hybrid approach provides atomistic description near the interface and continuum description deep into the substrate, increasing the accessible length scales and greatly reducing the computational cost. The results of the hybrid simulation are in good agreement with full multimillion-atom MD simulations: atomic structures at the lattice-mismatched interface between amorphous silicon nitride and silicon induce inhomogeneous stress patterns in the substrate that cannot be reproduced by a continuum approach alone.
Using a self-consistent linear combination of atomic orbitals method based on density-functional theory in a local-density approximation, the electronic structure in the high-temperature ceramics ␣-Si 3 N 4 and -Si 3 N 4 and at the Si͑111͒/Si 3 N 4 ͑001͒ interface have been calculated. The resulting charge transfer suggests that the ionic formula can be written as Si 3 ϩ1.24 N 4 Ϫ0.93 . For the Si͑111͒/Si 3 N 4 ͑001͒ interface, the silicon atoms from the silicon side lose some electrons to the nitrogen atoms of the silicon nitride side forming Si-N bonds at the interface. The calculated electronic density of states spectrum of Si 2 p core levels for this interface is in good agreement with x-ray photoemission spectroscopy experiments. ͓S0163-1829͑98͒06928-8͔
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