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In this study, the corrosion mechanisms of the AA2024-T3 and the AA2098-T351 were investigated and compared using various electrochemical techniques in 0.005 mol L −1 NaCl solution. The severe type of corrosion in the AA2098-T351 was intragranular attack (IGA) although trenching and pitting related to the constituent particles were seen. On the other hand, the AA2024-T3 exhibited severe localised corrosion associated with micrometric constituent particles, and its propagation was via grain boundaries leading to intergranular corrosion (IGC). Electrochemical techniques showed that the corrosion reaction in both alloys was controlled by diffusion. The non-uniform current distribution in both alloys showed that EIS was not a proper technique for comparing the corrosion resistance of the alloys. However, local electrochemical techniques were useful for the evaluation of the corrosion resistance of the alloys.

The corrosion behaviour of silanated AA2198‐T851 alloy substrates with and with no manufacturing‐process induced near‐surface deformed layer (MPI‐NSDL) has been investigated. Two methods (alkaline etching + desmutting and mechanical polishing) were employed in removing the MPI‐NSDL. Silanization was performed using 2‐bis‐triethoxysilylethane. Electrochemical impedance spectroscopy (EIS), salt spray test, and microscopy techniques were employed in the investigation of the corrosion behaviours. The studies revealed that polishing appeared to be the best silanating pre‐treatment (compared with degreasing and etching + desmutting) for the new generation AA2198‐T851 Al‐Cu‐Li alloy, and this was reflected in the EIS spectra. The etched + desmutted and the degreased surface with MPI‐NSDL did not respond well to silanization and presented more pitting sites per square millimeter. However, the severity of corrosion per pit was more on the polished sample compared with the other two. Also, the corrosion mechanisms were different for the three cases.

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