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The interest in terahertz photometric and imaging measurements has motivated the development of bandpass resonant filters to be coupled to multiple-pixel devices such as bolometer arrays. Resonant grids are relatively simple to fabricate, exhibiting high transmission at the central frequency, a narrow bandpass, and good rejection of the side frequencies of the spectrum. We have fabricated filters centered at different frequencies between 0.4 and 10 THz, using photolithography and electroforming techniques. Transmission measurements have shown center frequencies and bandwidths close to the design predictions. The performance of the filters was found not to be critically dependent on small physical deformations in the mesh, becoming more noticeable at higher frequencies (i.e., for smaller physical sizes). Wider bandwidths, needed to attain higher sensitivities in the continuum, were obtained by changing the design parameters for filters at 2 and 3 THz.

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This paper outlines a straightforward, fast, and low-cost method to fabricate polydimethylsiloxane (PDMS) chips. Termed sandwich bonding (SWB), this method requires only a laboratory oven. Initially, SWB relies on the reversible bonding of a coverslip over PDMS channels. The coverslip is smaller than the substrate, leaving a border around the substrate exposed. Subsequently, a liquid composed of PDMS monomers and a curing agent is poured onto the structure. Finally, the cover is cured. We focused on PDMS/glass chips because of their key advantages in microfluidics. Despite its simplicity, this method created high-performance microfluidic channels. Such structures featured self-regeneration after leakages and hybrid irreversible/reversible behavior. The reversible nature was achieved by removing the cover of PDMS with acetone. Thus, the PDMS substrate and glass coverslip could be detached for reuse. These abilities are essential in the stages of research and development. Additionally, SWB avoids the use of surface oxidation, half-cured PDMS as an adhesive, and surface chemical modification. As a consequence, SWB allows surface modifications before the bonding, a long time for alignment, the enclosure of sub-micron channels, and the prototyping of hybrid devices. Here, the technique was successfully applied to bond PDMS to Au and Al.