Light scattering measurement and analysis is a powerful tool for the characterization of optical and nonoptical surfaces. A new 3D scatter measurement system based on a detector matrix is presented. A compact light-scatter sensor is used to characterize the scattering and nanostructures of surfaces and to identify the origins of anisotropic scattering features. The results from the scatter sensor are directly compared with white light interferometry to analyze surface defects as well as surface roughness and the corresponding scattering distributions. The scattering of surface defects is modeled based on the Kirchhoff integral equation and the approach of Beckmann for rough surfaces.
Roughness-induced light scattering critically affects the performance of optical components, in particular at short wavelengths. We present a stand-alone instrument for angle-resolved scattering and reflectance measurements at 13.5 nm in the extreme-ultraviolet (EUV) spectral range. The achieved dynamic range allows even the scattering of high-quality EUV mirrors on extremely smooth substrates to be investigated. For Mo/Si multilayers, total scatter losses of several percent have been observed, depending on the substrate qualities as well as on roughening and smoothing effects during coating. Different approximate models for estimating the impact of roughness on scatter losses are discussed and compared with experimental results.
Subsurface damage (SSD) in optical components is almost unavoidably caused by mechanical forces involved during grinding and polishing and can be a limiting factor, in particular for applications that require high laser powers or an extreme material strength. In this paper, we report on the characterization of SSD in ground and polished optical surfaces, using different light scattering measurement techniques in the visible and extreme ultraviolet spectral ranges. The materials investigated include fused silica, borosilicate glass, and calcium fluoride. The scattering results are directly linked to classical destructive SSD characterization techniques, based on white light interferometry, optical microscopy, and atomic force microscopy of the substrate topography and cross sections obtained after etching in hydrofluoric acid and fracturing
The combination of a 10.6 μm main pulse CO2 laser and a 1064 nm pre-pulse Nd:YAG laser in EUV source concepts for HVM would require collector mirrors with an integrated spectral purity filter that suppresses both laser wavelengths. This paper discusses a new approach of a dual-wavelength spectral purity filter to suppress 10.6 μm and 1064 nm IR radiation at the same time. The dual-wavelength spectral purity filter combines two binary phase gratings that are optimized for 10.6 μm and 1064 nm, respectively. The dual phase grating structure has been realized on spherical sub-aperture EUV collector mirrors having an outer diameter of 150 mm. IR suppression factors of 260 at 10.6 μm and 620 at 1064 nm have been measured on the sub-aperture EUV collector while its EUV reflectance exceeded 64 % at 13.5 nm
Laser produced plasma sources are considered attractive for high-volume extreme-ultraviolet (EUV) lithography because of their high power at the target wavelength 13.5 nm. However, besides the required EUV light, a large amount of infrared (IR) light from the CO2 drive laser is scattered and reflected from the plasma as well as from the EUV mirrors in the optical system. Since these mirrors typically consist of molybdenum and silicon, the reflectance at IR wavelengths is even higher than in the EUV, which leads to high energy loads in the optical system. One option to reduce this is to structure the EUV multilayer, in particular the collector mirror, with an IR grating that has a high IR-suppression in the zeroth order. In this paper, the characterization of such an optical element is reported, including the IR-diffraction efficiency, the EUV performance (reflectance and scattering), and the relevant surface roughness. The measurement results are directly linked to the individual manufacturing steps.
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