The use of adhesive bonding in joining of materials with different characteristics is of major importance in a variety of microelectronic and photonic applications. The curing of such adhesives is also of great consequence, with the use of optical radiation for adhesive curing becoming the method of choice in various applications, especially bonding of components in microelectronics and fiber-optic assembly. This article reviews recent advances in the development of adhesives, their applications, and their curing methods using optical radiation; it also includes a brief overview of the adhesion mechanisms.
This paper describes an optical method that has been developed to accurately measure shrinkage during the cure of adhesives treated with UV light. The experiment was designed to measure changes in the volume of very small quantities of material appropriate to uses in the fiber-optic and micro-electronic industries. A spot-curing device (EFOS Inc.) was used to deliver a controlled exposure of UV-light with a known distribution of wavelengths to the sample. The results indicate that reproducible values for the volumetric shrinkage can be achieved using spot-curing methods. The technique described in this paper, combined with other experimental measurements under development, will assist in the selection of the appropriate adhesive for specific applications and the curing conditions needed to optimize its final properties.
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