Short channel a-Si:H TFT devices with Cu electrodes have investigated. The short channels are defined by our unique mask pattern and new plasma etch process. When channel length becomes shorter, the TFT characteristics (threshold voltage, off current, sub threshold voltage, etc.,) are degraded. These degraded characteristics are recovered and improved through the hydrogen plasma treatment(off current) and new gate insulator structure(threshold voltage).
This paper investigates behavior of drain bias stress and gate-drain bias stress under illumination for InGaZnO thin film transistors as the current-driver operated. Properties exhibit two-stage degradation behavior during drain bias stress. The photo-excited hole non-uniform trapping from illumination induces drain side barrier lowering and causes an apparent hump phenomenon of the subthreshold swing. However, the positive threshold voltage shift without a hump phenomenon after gate-drain bias stress is different degradation behaviors. It is reliant on whether or not an inversion layer exists in the channel. This work also employs capacitance-voltage measurement to further clarify the mechanism of degradation behaviors.
This paper investigates the instability of negative bias temperature in the dark and the illumination stresses for the InGaZnO thin film transistors. During the negative bias temperature illumination stress, properties exhibit an obvious negative threshold voltage shift and a significant degradation of subthreshold swing. The photoelectric heat effect that combined the effects of electric field, illumination, and temperature induces the generation of dangling bonds in the interface, resulting in an apparent degradation. It is related to the presence of light energy. Finally, this work also employs the capacitance-voltage measurement and recovery behavior to further clarify the mechanism of degradation behaviors.
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