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Nonequilibrium molecular-dynamics (MD) simulations show that shock-induced void collapse in copper occurs by emission of shear loops. These loops carry away the vacancies which comprise the void. The growth of the loops continues even after they collide and form sessile junctions, creating a hardened region around the collapsing void. The scenario seen in our simulations differs from current models that assume that prismatic loop emission is responsible for void collapse. We propose a dislocation-based model that gives excellent agreement with the stress threshold found in the MD simulations for void collapse as a function of void radius.

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It is shown that the short pulse durations (0.1-10 ns) in laser shock compression ensure a rapid decay of the pulse and quenching of the shocked sample in times that are orders of magnitude lower than in conventional explosively driven plate impact experiments. Thus, laser compression, by virtue of a much more rapid cooling, enables the retention of a deformation structure closer to the one existing during shock. The smaller pulse length also decreases the propensity for localization.

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Abstract. Single crystalline copper was subjected to quasi-isentropic compression via gas-gun and laser loading at pressures between 18 GPa and 59 GPa. The deformation substructure was analyzed via transmission electron microscopy (TEM). Twins and laths were evident at the highest pressures, and stacking faults and dislocation cells in the intermediate and lowest pressures, respectively. The Preston-Tonks-Wallace (PTW) constitutive description was used to model the slip-twinning process in both cases.