SummaryThis Extended Abstract describes a photoresist treatment yielding conformal coating of three-dimensional silicon structures. This even includes the sharp corners of through-holes obtained by anisotropic etching in 100-silicon. Resist reflow from these corners is avoided by replacing the commonly done baking procedure with a proper vacuum treatment. The investigated photoresist is Shipley's Eagle 2100 ED, a negative-working electrodepositable photoresist. Electrical frontside to backside interconnections have been made using this photorlssist as etch mask.
Abstract-We present microfabrication and characterization of truly three-dimensional (3-D) diffuser/nozzle structures in silicon. Chemical vapor deposition (CVD), reactive ion etching (RIE), and laser-assisted etching are used to etch flow chambers and diffuser/nozzle elements. The flow behavior of the fabricated elements and the dependence of diffuser/nozzle efficiency on structure geometry has been investigated. The large freedom of 3-D micromachining combined with rapid prototyping allows to characterize and optimize diffuser/nozzle structures. [199]
Structures have been etched in poly-silicon and amorphous silicon deposited on silicon oxide by laser direct writing. These patterns can be written with a high resolution and transferred to the underlying material via reactive ion etching. Three-dimensional structures can be obtained by multiple exposure of the silicon mask. Due to the fast turnaround time of direct writing processes, this technique can be applied for rapid prototyping of large-scale structures.
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