A process of combined rolling and uniaxial pressing with intermediate sintering steps for fabrication of screen-printed (Bi,Pb)2Sr2Ca2Cu3Ox thick films sandwiched between Ag substrates yields c-axis-oriented microstructures with a high critical current density (Jc) of 1.5×104 A/cm2 (77 K, 0 T) and 9.0×104 A/cm2 (23 K, 0 T). The measured Jc anisotropy at 77 K, as a function of the angle θ between B and c axis, is pronounced. An increase in B sharpens a peak at θ=90° (i.e., B⊥c) in the Jc vs θ curve, together with enhancement of the anisotropy ratio defined as Jc(B⊥c)/Jc(B∥c). In high fields above 0.5 T, the half-height angular width of the peak approaches an average misalignment angle (4°–6°) between the grains with increasing B.
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