1993
DOI: 10.1016/0921-4534(93)90995-3
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Fabrication, microstructure and critical current density of screen-printed Ag-(Bi, Pb)2Sr2Ca2Cu3O superconducting tapes

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Cited by 15 publications
(4 citation statements)
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“…7, the angular dependence of JC at 4.5K shows a shift of the peak angle from 8 =90° (i.e., B 1 c axis) and also some additional asymmetry. This is compared with a symmetrical angular dependence of Jc at 77 K with a sharp peak at 8 =90" [3]. In comparison with the results between 1 and 5T in Fig.…”
Section: Methodsmentioning
confidence: 92%
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“…7, the angular dependence of JC at 4.5K shows a shift of the peak angle from 8 =90° (i.e., B 1 c axis) and also some additional asymmetry. This is compared with a symmetrical angular dependence of Jc at 77 K with a sharp peak at 8 =90" [3]. In comparison with the results between 1 and 5T in Fig.…”
Section: Methodsmentioning
confidence: 92%
“…Assuming that Jc is dominated by the field component B =Bcos 8 parallel to the c axis in a tilted field [3], the angular dependence of JC is predicted using a series of the Jc values on magnetic fields for B 11 c axis that are collected by transport measurements through a magnetic loop -Bt 5 B 5 B t with the target field Bt (= 1 or 5T), followed by an initially increasing field up to Bt. As can be seen, the prediction for the peak position and also the overall behavior in the angular dependence of Jc agrees with the experimental result, except for the angular range around a peak where the experimental value is much lower than the prediction resulting from some misalignment between the grains [3]. The present study suggests the possibility that if the history effect exists, the Jc value in fields for 8 =90° (i.e., B I c axis) is smaller than the maximum value with respect to a field direction at the same fields and it cannot be regarded as the maximum value in fields any longer.…”
Section: Methodsmentioning
confidence: 99%
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“…It is important to note however, that organic additives were used to make the silver paste thinner, which allowed it to spread easily onto the silicon surface. Unlike traditional LIGA processing where electroplating applications are useful for a few microns of via metallization [30], this filling method was adopted from screen printing techniques currently used where materials are squeegee through a woven mesh onto a substrate [31]. In this work, the remaining photoresist layer actually served as the mesh which blocked the silver paste from contacting the substrate, and a sharp razor blade was continuously coursed over the through holes during filling.…”
Section: Fabrication Of Micro-coaxial Probementioning
confidence: 99%