Experimental and theoretical results are presented on the evolution of large elastic deformation, non-uniform curvature, shape changes and geometric instability in substrates of Si wafers with metal films. The critical diameter and thickness of the Si wafer, for which large deformation and shape instability occur, are identified, as functions of the line tension in the film (which is the product of the biaxial stress in the film and the film thickness). Observations of the curvature and shape variations along the wafer diameter and geometry-dependence of the shape instability compare favorably with those predicted by detailed finite element analyses.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.