1997
DOI: 10.1063/1.365042
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Large deformation and geometric instability of substrates with thin-film deposits

Abstract: Experimental and theoretical results are presented on the evolution of large elastic deformation, non-uniform curvature, shape changes and geometric instability in substrates of Si wafers with metal films. The critical diameter and thickness of the Si wafer, for which large deformation and shape instability occur, are identified, as functions of the line tension in the film (which is the product of the biaxial stress in the film and the film thickness). Observations of the curvature and shape variations along … Show more

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Cited by 112 publications
(86 citation statements)
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“…Since we have no reason to believe that there is a difference in how a film grows in the two orthogonal directions (aside from an in-plane texture), we expect that the observed difference in curvature is a result of a near-biaxial condition imposed by the sample holder/clamping arrangement. A similar effect is found by others 26 when using a rectangular substrate /springboard configuration.…”
Section: ∆D(t)/dsupporting
confidence: 74%
“…Since we have no reason to believe that there is a difference in how a film grows in the two orthogonal directions (aside from an in-plane texture), we expect that the observed difference in curvature is a result of a near-biaxial condition imposed by the sample holder/clamping arrangement. A similar effect is found by others 26 when using a rectangular substrate /springboard configuration.…”
Section: ∆D(t)/dsupporting
confidence: 74%
“…We then compare the analytical predictions with real-time experimental measurements. It should be noted at this point that nonlinear distortions of large wafers were investigated experimentally by Finot et al, 16 who used a geometrical grid projection method to record curvatures resulting from a variety of deposition conditions and geometrical parameters.…”
Section: Introductionmentioning
confidence: 99%
“…Formula (1) follows from an analysis of a film-substrate system, which is based on several assumptions [15,16]. The main assumptions are (i) both the film thickness and substrate thicknesses are small compared to the lateral dimensions; (ii) the film thickness is much less than the substrate thickness; (iii) the substrate material is homogeneous, isotropic, and linearly elastic, and the film material is isotropic; (iv) edge effects near the periphery of the substrate are inconsequential; (v) all physical quantities such as Young's modulus and Poisson's ratio are invariant under change in positions parallel to the interface; (vi) all stress gradients in the thickness direction vanish throughout the material; and (vii) the strains and the rotations are small.…”
Section: Methodsmentioning
confidence: 99%