Out-of-plane ply wrinkling is a major quality issue for carbon fiber reinforced prepreg parts. Its triggers are numerous and not every influencing parameter is fully understood, yet. The research presented in this paper aims at providing a better insight into ply wrinkling generated during autoclave compaction using caul plates. A detailed description of the experimental set-up and the applied methodology is provided. Statistical analyses of varying influencing factors such as part thickness, geometry, tool–part interaction, and laminate lay-up are presented. This, in turn, generates a better understanding of their impact on fiber wrinkling risk and size. Part geometry and compaction deformation show the most significant influence on wrinkle size. However, for the given manufacturing concept, tool–part interaction also plays a significant role. It influences both the dimension and location of the wrinkles, as well as the existence and size of a critical flange length of the part. A noteworthy effect on wrinkle generation and size can also be observed when adding unidirectional plies to an otherwise fabric laminate.

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This study reports a method to reuse GaAs substrates with a batch process for thin film light emitting diode (TF-LED) production. The method is based on an epitaxial lift-off technique. With the developed reclaim process, it is possible to get an epi-ready GaAs surface without additional time-consuming and expensive grinding/polishing processes. The reclaim and regrowth process was investigated with a one layer epitaxial test structure. The GaAs surface was characterized by an atomic force microscope directly after the reclaim process. The crystal structure of the regrown In0.5(Ga0.45Al0.55)0.5P (Q55) layer was investigated by high resolution x-ray diffraction and scanning transmission electron microscopy. In addition, a complete TF-LED grown on reclaimed GaAs substrates was electro-optically characterized on wafer level. The crystal structure of the epitaxial layers and the performance of the TF-LED grown on reclaimed substrates are not influenced by the developed reclaim process. This process would result in reducing costs for LEDs and reducing much arsenic waste for the benefit of a green semiconductor production.

Phosphide-based thin-film light-emitting diodes (TF-LEDs) lattice-matched to GaAs are well established in optoelectronics in the wavelength range between 550 and 650 nm. In this work, we investigate the impact of oxidized AlAs to overlying phosphide-based pseudomorphically grown epitaxial structures. Oxidation of a buried AlAs sacrificial layer allows the separation of the grown TF-LED epitaxy from its substrates and enables an oxidation lift-off process. To evaluate the strain effect of progressing oxidation on the structure of the chip, we perform high-resolution x-ray diffraction analysis on as-grown, mesa-structured, semi-oxidized, and completely laterally oxidized chips. At each state, a pseudomorphic phosphide-based InAlP layer is found. The InAlP layer exhibits a tensile out-of-plane strain of approximately 0.20% and a compressive in-plane strain of approx. −0.19%. Additionally, scanning transmission electron microscopy, energy-dispersive x-ray spectroscopy, and μ-photoluminescence were used for investigation of the boundary zone of the oxidation front of AlAs, the interfaces between phosphide-based semiconductors (InAlP/InGaAlP) and oxidized amorphous AlAs and the light emission of InGaAlP multiple quantum wells.