The study results of the copper alloying effect on the microstructure and thermal coefficient of linear expansion (TCLE) of high aluminum alloys for special purposes based on the Al – (20÷30)% Si system are presented. It was found that alloy building of Al – 20% Si with copper in large quantities eliminates the linear expansion anomaly characteristic to the binary alloy and leads to a significant decrease in the thermal expansion coefficient over the entire temperature range of the tests. It was shown that Al–30%Si–20÷40% Cu alloys have stable TCLE in the low-temperature test interval. Metallographic analysis of high alloys showed that copper introduced in amounts of more than 20% contributes to a change in the morphology of the silicon phase and triple eutectic.
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