The performance of future chip multi-processors will only scale with the number of integrated cores if there is a corresponding increase in memory access efficiency. The focus of this paper on a 3D-stacked wavelength-routed optical layer for high bandwidth and low latency processor-memory communication goes in this direction and complements ongoing efforts on photonically integrated bandwidth-rich DRAM devices. This target environment dictates layout constraints that make the difference in discriminating between alternative design choices of the optical layer. This paper assesses network partitioning options and bandwidth scalability techniques with deep technology and layout awareness, the main contribution lying in the characterization and precise quantification of such interaction effects between the technology platform, the layout constraints and the network-level quality metrics of a passive optical NoC
A realistic assessment of optical networks-on-chip (ONoCs) can be performed only in the context of a comprehensive floorplanning strategy for the system as a whole, especially when the 3-D stacking of electronic and optical layers is implemented. This paper fosters layout-aware ONoC design by developing a physical mapping methodology for wavelength-routed ONoC topologies subject to the floorplanning, placement, and routing constraints that arise in a 3-D-stacked environment. As a result, this paper is able to compare the power efficiency and signal-to-noise ratio of ring-based versus filter-based wavelength-routed topologies as determined by their physical design flexibility
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